Patents by Inventor Johannes Bader

Johannes Bader has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220072609
    Abstract: The invention relates to a method for powder pressing at least two pressed parts, in particular ceramic powder pressed parts and/or metal powder pressed parts, wherein a first powder (17) for pressing a first pressed part is filled into a first cavity (13) of a die (12) with a first filling level and a second powder (18) for pressing a second pressed part is filled into a second cavity (14) of the die (12) with a second filling level, wherein the first and second filling levels are individually adjusted. Preferably, the first powder is filled via a first filling shoe and the second powder is filled via a second filling shoe, wherein the two filling shoes, at least temporarily, are not moved simultaneously. A powder pressing device is also claimed which is suitable for implementing the aforementioned method.
    Type: Application
    Filed: February 11, 2020
    Publication date: March 10, 2022
    Inventors: Michael Silbermann, Christian MÜLLER, Johannes Bader
  • Patent number: 11055596
    Abstract: A method for manufacturing a chip card is provided by electroconductive connecting of a chip module to a chip-card body having at least one electrical contact area. The method includes adhesively connecting the chip module to the chip-card body by a thermoplastic, electroconductive elastomeric material such that the chip module is conductively connected to at least one electrical contact area of the chip-card body.
    Type: Grant
    Filed: January 23, 2020
    Date of Patent: July 6, 2021
    Assignee: GIESECKE+DEVRIENT MOBILE SECURITY GMBH
    Inventor: Johannes Bader
  • Publication number: 20200160138
    Abstract: For manufacturing a chip card, a chip module is connected adhesively to a chip-card body electroconductively by a thermoplastic, electro conductive elastomeric material, and connected to at least one electrical contact area of the chip-card body electroconductively by the elastomeric material.
    Type: Application
    Filed: January 23, 2020
    Publication date: May 21, 2020
    Inventor: Johannes BADER
  • Publication number: 20120250282
    Abstract: For manufacturing a chip card, a chip module (6) is connected adhesively to a chip-card body (2) electroconductively by a thermoplastic, electroconductive elastomeric material (5), and connected to at least one electrical contact area (2b) of the chip-card body (2) electroconductively by the elastomeric material (5).
    Type: Application
    Filed: December 13, 2010
    Publication date: October 4, 2012
    Applicant: Giesecke & Devrient GmbH
    Inventor: Johannes Bader