Patents by Inventor Johannes Bernardus Petrus Janssen

Johannes Bernardus Petrus Janssen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing encapsulated electronic components, particularly integrated circuits
    Patent number: 6921682
    Abstract: A method for manufacturing encapsulated electronic components, particularly integrated circuits, includes the steps of: a) attaching electronic components on a first side of a lead frame and electrically connecting the electronic components to the lead frame; b) using a mould to encapsulate the electronic components with an encapsulating material on just a first side of the lead frame, while a second side of the lead frame is substantially completely shielded with the aid of an adhesive film; and c) removing the adhesive film and separating, along cutting lines, individual encapsulated electronic components. The bonding of the adhesive film to the second side to be shielded of the lead frame takes place between step a) and step b).
    Type: Grant
    Filed: July 2, 2003
    Date of Patent: July 26, 2005
    Assignee: “3P” Licensing B. V.
    Inventors: Johannes Bernardus Petrus Janssen, Johannes Bernardus de Vrught
  • Method for manufacturing encapsulated electronic components, particularly integrated circuits
    Publication number: 20040005737
    Abstract: A method for manufacturing encapsulated electronic components, particularly integrated circuits, includes the steps of: a) attaching electronic components on a first side of a lead frame and electrically connecting the electronic components to the lead frame; b) using a mould to encapsulate the electronic components with an encapsulating material on just a first side of the lead frame, while a second side of the lead frame is substantially completely shielded with the aid of an adhesive film; and c) removing the adhesive film and separating, along cutting lines, individual encapsulated electronic components. The bonding of the adhesive film to the second side to be shielded of the lead frame takes place between step a) and step b).
    Type: Application
    Filed: July 2, 2003
    Publication date: January 8, 2004
    Applicant: "3P" Licensing B.V.
    Inventors: Johannes Bernardus Petrus Janssen, Johannes Bernardus de Vrught
  • Method for manufacturing encapsulated electronic components, particularly integrated circuits
    Patent number: 6613607
    Abstract: A method for manufacturing encapsulated electronic components, particularly integrated circuits, is provided. The method includes the steps of: a) attaching electronic components on a first side of an electrically conducting support and electrically connecting the electronic components to the electrically conducting support; b) using a mold to encapsulate the electronic components with an encapsulating material on just the first side of the electrically conducting support, while a second side of the support is substantially completely shielded with the aid of an adhesive film; and c) removing the adhesive film and separating, along cutting lines, the individual encapsulated electronic components, wherein bonding of the adhesive film to a second side to be shielded of the electrically conducting support takes place between step a) and step b).
    Type: Grant
    Filed: October 29, 2001
    Date of Patent: September 2, 2003
    Assignee: “3P” Licensing B.V.
    Inventors: Johannes Bernardus Petrus Janssen, Johannes Bernardus de Vrught
  • Method for manufacturing encapsulated electronic components, particularly integrated circuits
    Publication number: 20020064926
    Abstract: A method for manufacturing encapsulated electronic components, particularly integrated circuits, is provided. The method includes the steps of: a) attaching electronic components on a first side of an electrically conducting support and electrically connecting the electronic components to the electrically conducting support; b) using a mould to encapsulate the electronic components with an encapsulating material on just the first side of the electrically conducting support, while a second side of the support is substantially completely shielded with the aid of an adhesive film; and c) removing the adhesive film and separating, along cutting lines, the individual encapsulated electronic components, wherein bonding of the adhesive film to a second side to be shielded of the electrically conducting support takes place between step a) and step b).
    Type: Application
    Filed: October 29, 2001
    Publication date: May 30, 2002
    Applicant: "3P" Licensing B.V.
    Inventors: Johannes Bernardus Petrus Janssen, Johannes Bernardus de Vrught