Abstract: An optical imaging connector connects an optical fiber to a lens located adjacent to an imaging target, such as the brain tissue of a laboratory animal. A fiber assembly of the connector includes a ferrule holding the fiber and a ferrule adapter with a radially-extending coupler. The fiber assembly is removably joined to a lens assembly that holds the lens adjacent to a receptacle in which the ferrule is inserted coaxial to the lens. The lens holder has a radially-extending coupler that engages the coupler of the ferrule adapter to hold the two assemblies together. A focus adjustment mechanism, such as a screw, is manually adjustable by a user to change the position of the second coupler relative to the lens holder, and thereby change the axial position of the ferrule in the ferrule receptacle. One or more magnets may be used to provide a mutual attraction between the couplers.

Abstract: An optical imaging connector connects an optical fiber to a lens located adjacent to an imaging target, such as the brain tissue of a laboratory animal. A fiber assembly of the connector includes a ferrule holding the fiber and a ferrule adapter with a radially-extending coupler. The fiber assembly is removably joined to a lens assembly that holds the lens adjacent to a receptacle in which the ferrule is inserted coaxial to the lens. The lens holder has a radially-extending coupler that engages the coupler of the ferrule adapter to hold the two assemblies together. A focus adjustment mechanism, such as a screw, is manually adjustable by a user to change the position of the second coupler relative to the lens holder, and thereby change the axial position of the ferrule in the ferrule receptacle. One or more magnets may be used to provide a mutual attraction between the couplers.

Abstract: A device for cooling a laser diode pump comprising a Low Size Weight Power Efficient (SWAP) Laser Diode (LSLD) assembly, including a laser diode coupled to a submount on a first surface, the submount comprising a first thermally conductive material and a heatsink coupled to a second surface of the submount, wherein the heatsink comprises a second thermally conductive material, the heatsink comprising one or more members formed on a side opposite the coupled submount.

Abstract: Disclosed herein are Low Size Weight and Power efficient Laser Diode pump modules and High Power Fiber Amplifiers incorporating such pump modules for amplifying laser light produced by a seed laser. The pump modules are configured for forced fluid cooling, and are provided with cooling channels that allow for varying combinations of a coolant mass flow rate F of the coolant, a pressure drop P of the coolant, and a steady state temperature T of the laser diodes in the pump modules, uniquely and significantly, and thereby allowing for optimizing such variables for a particular application.

Abstract: A device for cooling a laser diode pump comprising a Low Size Weight Power Efficient (SWAP) Laser Diode (LSLD) assembly, including a laser diode coupled to a submount on a first surface, the submount comprising a first thermally conductive material and a heatsink coupled to a second surface of the submount, wherein the heatsink comprises a second thermally conductive material, the heatsink comprising one or more members formed on a side opposite the coupled submount.

Abstract: A device for cooling a laser diode pump comprising a Low Size Weight Power Efficient (SWAP) Laser Diode (LSLD) assembly, including a laser diode coupled to a submount on a first surface, the submount comprising a first thermally conductive material and a heatsink coupled to a second surface of the submount, wherein the heatsink comprises a second thermally conductive material, the heatsink comprising one or more members formed on a side opposite the coupled submount.

Abstract: Disclosed herein are Low Size Weight and Power efficient Laser Diode pump modules and High Power Fiber Amplifiers incorporating such pump modules for amplifying laser light produced by a seed laser. The pump modules are configured for forced fluid cooling, and are provided with cooling channels that allow for varying combinations of a coolant mass flow rate F of the coolant, a pressure drop P of the coolant, and a steady state temperature T of the laser diodes in the pump modules, uniquely and significantly, and thereby allowing for optimizing such variables for a particular application.

Abstract: A device for cooling a laser diode pump comprising a Low Size Weight Power Efficient (SWAP) Laser Diode (LSLD) assembly, including a laser diode coupled to a submount on a first surface, the submount comprising a first thermally conductive material and a heatsink coupled to a second surface of the submount, wherein the heatsink comprises a second thermally conductive material, the heatsink comprising one or more members formed on a side opposite the coupled submount.