Patents by Inventor Johannes Dippold

Johannes Dippold has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9661773
    Abstract: An electrical assembly for a motor vehicle includes a housing and two groups of electronic components that are installed in the housing and are encased using a thermosetting potting compound. Furthermore, the assembly includes two groups of connecting contacts. One of the connecting contacts is allocated respectively to one of the two groups of the electronic components. The connecting contacts are guided through the housing so as to electrically contact the respective electronic component. At least one of the groups of connecting contacts is surrounded on the inner side of the housing by a sealing collar that protrudes from the housing. The sealing collar is embedded during the process of assembling the assembly entirely or in part in the potting compound prior to the curing of the thermosetting potting compound.
    Type: Grant
    Filed: May 21, 2015
    Date of Patent: May 23, 2017
    Assignee: Brose Fahrzeugteile GmbH & Co. Kommanditgesellschaft, Hallstadt
    Inventors: Anto Mijac, Maik Ruemmler, Johannes Dippold
  • Publication number: 20150342071
    Abstract: An electrical assembly for a motor vehicle includes a housing and two groups of electronic components that are installed in the housing and are encased using a thermosetting potting compound. Furthermore, the assembly includes two groups of connecting contacts. One of the connecting contacts is allocated respectively to one of the two groups of the electronic components. The connecting contacts are guided through the housing so as to electrically contact the respective electronic component. At least one of the groups of connecting contacts is surrounded on the inner side of the housing by a sealing collar that protrudes from the housing. The sealing collar is embedded during the process of assembling the assembly entirely or in part in the potting compound prior to the curing of the thermosetting potting compound.
    Type: Application
    Filed: May 21, 2015
    Publication date: November 26, 2015
    Inventors: ANTO MIJAC, MAIK RUEMMLER, JOHANNES DIPPOLD
  • Publication number: 20140076525
    Abstract: The present invention relates to a temperature-control element. The present invention relates to a temperature-control element, having at least one surface region with an electrically insulating and thermally conductive coating, in particular a ceramic coating provided on said surface region, and attached to the coating is at least one electronic component which is thermally connected to the temperature-control element and is configured to be electrically insulating with respect to the temperature-control element. The present invention also relates to a method for attaching an electronic component to the temperature-control element.
    Type: Application
    Filed: February 15, 2012
    Publication date: March 20, 2014
    Inventors: Andy Mantey, Johannes Dippold