Patents by Inventor Johannes HACKL

Johannes HACKL has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11340268
    Abstract: A method may include pressing a sensor module onto a control board such that the sensor module is at an initial position where an air gap is present between a module body of the sensor module and the control board such that compliant pins of the sensor module are partially inserted into the control board. The method may include mounting the control board on a power module to cause pins of the power module to be at least partially inserted into the control board and the sensor module to be at least partially inserted in the power module such that a protrusion is through an opening in a busbar. The method may include pressing the control board onto the power module to cause the pins of the power module to be further inserted into the control board, the sensor module to be further inserted in the power module, and the sensor module to be at a final position.
    Type: Grant
    Filed: September 21, 2020
    Date of Patent: May 24, 2022
    Assignee: Infineon Technologies AG
    Inventors: Gerald Wriessnegger, Leo Aichriedler, Tomas Manuel Reiter, Christoph Koch, Andreas Schenk, Johannes Hackl, Volker Thorsten Schmidt
  • Publication number: 20220091160
    Abstract: A method may include pressing a sensor module onto a control board such that the sensor module is at an initial position where an air gap is present between a module body of the sensor module and the control board such that compliant pins of the sensor module are partially inserted into the control board. The method may include mounting the control board on a power module to cause pins of the power module to be at least partially inserted into the control board and the sensor module to be at least partially inserted in the power module such that a protrusion is through an opening in a busbar. The method may include pressing the control board onto the power module to cause the pins of the power module to be further inserted into the control board, the sensor module to be further inserted in the power module, and the sensor module to be at a final position.
    Type: Application
    Filed: September 21, 2020
    Publication date: March 24, 2022
    Inventors: Gerald WRIESNEGGER, Leo AICHRIEDLER, Tomas Manuel REITER, Christoph KOCH, Andreas SCHENK, Johannes HACKL, Volker Thorsten SCHMIDT
  • Publication number: 20090314522
    Abstract: The invention relates to a multifunctional printed circuit board comprising at least one additional functional element in the form of a round or rectangular conductor which is at least partially fastened on an electrically conducting strip conductor structure by ultrasound or friction welding in a mechanical and electrical and thermally conducting and planar manner and in such a fashion that an intermetal compound is formed. The invention also relates to a method for producing said printed circuit board, to its use as a wiring element for complex structures that is suitable for high current conduction and to uses for a specific thermal management.
    Type: Application
    Filed: January 16, 2007
    Publication date: December 24, 2009
    Inventors: Rudolf Janesch, Erich Strummer, Johann Hackl