Abstract: A system has a circuit board, an integrated circuit being mounted on the circuit board by external contacts, and a cover irreversibly connected to the circuit board. The cover covers the external contacts so that external access to the external contacts is prohibited by the cover.

Abstract: A system has a circuit board, an integrated circuit being mounted on the circuit board by external contacts, and a cover irreversibly connected to the circuit board. The cover covers the external contacts so that external access to the external contacts is prohibited by the cover.

Abstract: A three-dimensionally integrated electronic assembly includes a substrate that includes active circuitry formed therein. At least one electronic component (e.g., an integrated circuit chip, active component, passive component, active assembly, and/or passive assembly) is mounted on the substrate. At least one redistribution connection is disposed between the substrate and at least one electronic component. Each electronic component is electrically coupled to the substrate and/or another electronic component mounted on the substrate by means of the redistribution connection.

Abstract: An electronic device includes a first semiconductor device and a second semiconductor device mounted over the first semiconductor device. An encapsulation material surrounds the first and second semiconductor devices so that the first and second semiconductor devices are embedded within a molded package. A plug connector extends from the molded package and is electrically coupled to at least one of the first and second semiconductor devices.