Abstract: Embodiments are provided for a multi-die packaged semiconductor device including: a panel of embedded dies including a plurality of radio frequency (RF) dies, wherein each RF die includes RF front-end circuitry, each RF die has an active side that includes a plurality of pads, each RF die has a back side exposed in a back side of the panel; a plurality of antenna connectors formed on a subset of the plurality of pads of each RF die; and an array of antennas formed over a front side of the panel and connected to the plurality of antenna connectors.

Abstract: Embodiments are provided for a multi-die packaged semiconductor device including: a panel of embedded dies including a plurality of radio frequency (RF) dies, wherein each RF die includes RF front-end circuitry, each RF die has an active side that includes a plurality of pads, each RF die has a back side exposed in a back side of the panel; a plurality of antenna connectors formed on a subset of the plurality of pads of each RF die; and an array of antennas formed over a front side of the panel and connected to the plurality of antenna connectors.

Abstract: Embodiments are provided that include a method for fabricating a multi-die package including: placing a plurality of flip chip dies and splitter dies on the sacrificial carrier; performing solder reflow to join solder bumps of each flip chip die and each splitter die to the sacrificial carrier that includes test probe circuitry; testing the flip chip and splitter dies; replacing any faulty dies; overmolding the flip chip and splitter dies on the sacrificial carrier to form a panel of embedded dies; planarizing the panel of embedded dies to expose back surfaces of the embedded dies; forming a metallization layer across the back surface of the panel of embedded dies; and removing the sacrificial carrier to expose a front surface of the panel of embedded dies, wherein a contact surface of each solder bump of each flip chip die and splitter die is exposed in the front surface.

Abstract: Embodiments are provided that include a method for fabricating a multi-die package including: placing a plurality of flip chip dies and splitter dies on the sacrificial carrier; performing solder reflow to join solder bumps of each flip chip die and each splitter die to the sacrificial carrier that includes test probe circuitry; testing the flip chip and splitter dies; replacing any faulty dies; overmolding the flip chip and splitter dies on the sacrificial carrier to form a panel of embedded dies; planarizing the panel of embedded dies to expose back surfaces of the embedded dies; forming a metallization layer across the back surface of the panel of embedded dies; and removing the sacrificial carrier to expose a front surface of the panel of embedded dies, wherein a contact surface of each solder bump of each flip chip die and splitter die is exposed in the front surface.