Patents by Inventor Johannes Hirschle

Johannes Hirschle has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10505489
    Abstract: A power module for an electric motor includes at least one semiconductor switch half bridge. The half bridge includes a high-side semiconductor switch and a low-side semiconductor switch. Each switch has a contact gap terminal formed by a surface region of the switch, in particular a flat surface region. The contact gap terminals, in particular a normal vector of the terminals, each points in a same direction. At least one electrically conductive layer is enclosed between the switches and electrically connects the contact gap terminal of the low-side semiconductor switch and the contact gap terminal of the high-side semiconductor switch of the half bridge to each other. Preferably an output terminal of the half bridge is formed by at least one electrically conductive layer.
    Type: Grant
    Filed: November 17, 2016
    Date of Patent: December 10, 2019
    Assignee: Robert Bosch GmbH
    Inventors: Erich Ilic, Johannes Hirschle, Walter Von Emden, Volker Betz
  • Publication number: 20180351498
    Abstract: A power module for an electric motor includes at least one semiconductor switch half bridge. The half bridge includes a high-side semiconductor switch and a low-side semiconductor switch. Each switch has a contact gap terminal formed by a surface region of the switch, in particular a flat surface region. The contact gap terminals, in particular a normal vector of the terminals, each points in a same direction. At least one electrically conductive layer is enclosed between the switches and electrically connects the contact gap terminal of the low-side semiconductor switch and the contact gap terminal of the high-side semiconductor switch of the half bridge to each other. Preferably an output terminal of the half bridge is formed by at least one electrically conductive layer.
    Type: Application
    Filed: November 17, 2016
    Publication date: December 6, 2018
    Inventors: Erich Ilic, Johannes Hirschle, Walter Von Emden, Volker Betz
  • Patent number: 9455609
    Abstract: The invention relates to an electric motor, in particular an electronically commutated electric motor. The electric motor has a stator, a rotor and a housing, which accommodates at least the stator and the rotor in a cavity. The electric motor also has a power output stage, which is connected to the stator and is designed to energize the stator in order to induce a rotating magnetic field. The power output stage has at least one power semiconductor with a thermal contact area, wherein the thermal contact area is thermally conductively connected to the housing, with the result that heat generated in the power semiconductor can be dissipated to the housing. According to the invention, the housing has a housing cup, which at least partially surrounds the cavity and is preferably thermally conductive and which has a cup wall, wherein the cup wall has a mating contact area corresponding to the thermal contact area.
    Type: Grant
    Filed: September 7, 2011
    Date of Patent: September 27, 2016
    Assignee: Robert Bosch GmbH
    Inventors: Thomas Hennecke, Michael Heim, Hans Irion, Gerhard Braun, Frank Wehrmann, Georg Voegele, Sigmund Braun, Johannes Hirschle, Alexander Fink
  • Publication number: 20130187490
    Abstract: The invention relates to an electric motor, in particular an electronically commutated electric motor. The electric motor has a stator, a rotor and a housing, which accommodates at least the stator and the rotor in a cavity. The electric motor also has a power output stage, which is connected to the stator and is designed to energize the stator in order to induce a rotating magnetic field. The power output stage has at least one power semiconductor with a thermal contact area, wherein the thermal contact area is thermally conductively connected to the housing, with the result that heat generated in the power semiconductor can be dissipated to the housing. According to the invention, the housing has a housing cup, which at least partially surrounds the cavity and is preferably thermally conductive and which has a cup wall, wherein the cup wall has a mating contact area corresponding to the thermal contact area.
    Type: Application
    Filed: September 7, 2011
    Publication date: July 25, 2013
    Applicant: ROBERT BOSCH GMBH
    Inventors: Thomas Hennecke, Michael Heim, Hans Irion, Gerhard Braun, Frank Wehrmann, Georg Voegele, Sigmund Braun, Johannes Hirschle, Alexander Fink