Abstract: The invention relates to a method for processing a movable substrate by means of laser, wherein the processing results in the release of material separated from the substrate, wherein during processing of the substrate a higher pressure prevails on the side of the substrate where the substrate is impinged by the laser beam than on the other side of the substrate, and to a device for performing such a processing, wherein the device comprises guide means for guiding the substrate and laser processing means adapted to cast onto the substrate a laser spot which processes the substrate in a laser processing zone, and comprises means for generating a higher pressure on the side of the substrate where the substrate is impinged by the laser beam than on the other side of the substrate.

Abstract: The invention relates to a method for processing a movable substrate by means of laser, wherein the processing results in the release of material separated from the substrate, wherein during processing of the substrate a higher pressure prevails on the side of the substrate where the substrate is impinged by the laser beam than on the other side of the substrate, and to a device for performing such a processing, wherein the device comprises guide means for guiding the substrate and laser processing means adapted to cast onto the substrate a laser spot which processes the substrate in a laser processing zone, and comprises means for generating a higher pressure on the side of the substrate where the substrate is impinged by the laser beam than on the other side of the substrate.

Abstract: The invention relates to a carrier representing value provided with recognizable pattern, for instance in the form of giro checks, bankchecks, banknotes, shares, bonds and other documents representing a value, wherein the patterns are formed by parts treated by means of a laser beam. This object is reached in that the patterns have been provided by means of a laser light beam. The use of a laser beam makes it possible to apply particularly fine structures which either cannot be applied with other treating methods, or only with the greatest financial effort. The use of laser beams enables variation of the width or depth of the channels or perforations which is almost impossible with other treating methods.