Abstract: Method of manufacturing a semiconductor device, in which on a region of silicon oxide (5) situated next to a region of monocrystalline silicon (4) at the surface (3) of a semiconductor body (1), a non-monocrystalline auxiliary layer (8) is formed. The auxiliary layer is formed in two steps. In the first step, the silicon body is heated in an atmosphere comprising a gaseous arsenic compound; in the second step it is heated in an atmosphere comprising a gaseous silicon compound instead of said arsenic compound. Thus, the regions of silicon oxide are provided with an amorphous or polycrystalline silicon seed layer in a self-aligned manner.

Abstract: The present invention provides for a method of fabricating a semiconductor device comprising a non-selectively grown SiGe(C) heterojunction bipolar transistor including the steps of forming an insulating layer (12, 40) on a substrate and providing a layer structure including a conductive layer (14, 42) on the insulating layer (12, 40), etching a transistor area opening (12, 44) through the conductive layer (14, 42), depositing a SiGe base layer (24, 46) on the inner wall of the transistor area opening (22, 44) and forming an insulator (32, 52) on an upper surface so as to fill the transistor area opening wherein prior to the filling step, a nitride layer (30, 50) is formed as an inner layer of the transistor area opening (22, 44).