Abstract: A method for forming an electrically conductive via in a substrate that includes the steps of: forming a through hole in a first substrate; bringing a first surface of a second substrate into contact with the first surface of the first substrate, such that the through hole in the first substrate is covered by the first surface of the second substrate; filling the through hole in the first substrate with an electrically conductive material by electroplating to form the electrically conductive via, and removing the second substrate, wherein the first surface of the first and the second substrate each have a surface roughness Ra of less than 2 nm, preferably less than 1 nm, more preferably less than 0.5 nm, and the first surface of the first and the second substrate are brought in direct contact with each other, such that a direct bond is formed there between.

Abstract: The invention relates to method for bonding at least two substrates, for example made from glass, silicon, ceramic, aluminum, or boron, by using an intermediate thin film metal layer for providing the bonding, said method comprising the following steps of: a) providing said two substrates; b) depositing said thin film metal layer on at least a part of a surface of a first substrate of the two substrates; c) bringing a surface of the second substrate into contact with said thin film metal layer on said surface of the first substrate such that a bonding between the second substrate and the thin film metal layer on the first substrate is provided; and d) at least locally strengthening the bonding between the second substrate and the thin film metal layer on the first substrate. The invention also relates to a device comprising two substrates, for example made from glass, silicon, ceramic, aluminum, or boron, and an intermediate thin film metal layer.

Abstract: The invention relates to method for bonding at least two substrates, for example made from glass, silicon, ceramic, aluminum, or boron, by using an intermediate thin film metal layer for providing the bonding, said method comprising the following steps of: a) providing said two substrates; b) depositing said thin film metal layer on at least a part of a surface of a first substrate of the two substrates; c) bringing a surface of the second substrate into contact with said thin film metal layer on said surface of the first substrate such that a bonding between the second substrate and the thin film metal layer on the first substrate is provided; and d) at least locally strengthening the bonding between the second substrate and the thin film metal layer on the first substrate. The invention also relates to a device comprising two substrates, for example made from glass, silicon, ceramic, aluminum, or boron, and an intermediate thin film metal layer.

Abstract: Measurement device (10) for taking a liquid sample, comprising: a measurement portion (15) with a measurement surface (20), for being in use contacted with the liquid surface and a plug portion (40) having a plurality of electrical contacts (50), wherein the plug portion (40) is mountable to a socket (110) of a measurement evaluation apparatus (100).

Abstract: A biological microfluidics chip comprising a substrate, a microfluidic inlet port defining an opening in a surface of the substrate, and a microfluidic outlet port defining an opening in a surface of the substrate. The biological microfluidics chip also comprises a plurality of wells extending from a top surface of the substrate, wherein each well is bounded by one or more walls, and an inlet opening and an outlet opening are provided in a wall of each of the plurality of wells. An inlet microfluidic channel is provided in the substrate to connect the microfluidic inlet port to each of the inlet openings in the walls of the wells, and an outlet microfluidic channel is provided in the substrate to connect each of the outlet openings in the walls of the wells to the microfluidic outlet port.

Abstract: The invention relates to a method for forming an electrically conductive via in a substrate and such a substrate comprising an electrically conductive, said method comprising the steps, to be performed in suitable sequence, of: a) providing a first substrate as said substrate; b) forming a through hole in said first substrate; c) providing a second substrate; d) bringing a first surface of said second substrate into contact with said first surface of said first substrate, such that said through hole in said first substrate is covered by said first surface of said second substrate; e) filling said through hole in said first substrate with an electrically conductive material by means of electroplating for forming said electrically conductive via, and f) removing said second substrate, wherein said first surface of said first substrate and said first surface of said second substrate each have a surface roughness R a of less than 2 nm, preferably less than 1 nm, more preferably less than 0.

Abstract: The invention relates to method for bonding at least two substrates, for example made from glass, silicon, ceramic, aluminum, or boron, by using an intermediate thin film metal layer for providing the bonding, said method comprising the following steps of: a) providing said two substrates; b) depositing said thin film metal layer on at least a part of a surface of a first substrate of the two substrates; c) bringing a surface of the second substrate into contact with said thin film metal layer on said surface of the first substrate such that a bonding between the second substrate and the thin film metal layer on the first substrate is provided; and d) at least locally strengthening the bonding between the second substrate and the thin film metal layer on the first substrate. The invention also relates to a device comprising two substrates, for example made from glass, silicon, ceramic, aluminum, or boron, and an intermediate thin film metal layer.

Abstract: A biological microfluidics chip (100) comprising a substrate (102), a microfluidic inlet port (104) defining an opening in a surface of the substrate (102), and a microfluidic outlet port (106) defining an opening in a surface of the substrate (102). The biological microfluidics chip (100) also comprises a plurality of wells (108) extending from a top surface (110) of the substrate, wherein each well (108) is bounded by one or more walls, and an inlet opening (112) and an outlet opening (114) are provided in a wall of each of the plurality of wells (108). An inlet microfluidic channel (116) is provided in the substrate (102) to connect the microfluidic inlet port (104) to each of the inlet openings (112) in the walls of the wells, and an outlet microfluidic channel (118) is provided in the substrate to connect each of the outlet openings (114) in the walls of the wells to the microfluidic outlet port (106).

Abstract: Methods for manufacturing a microstructure, wherein use is made of a powder blasting and/or etching and a single mask layer with openings and structures of varying dimensions, wherein the mask layer at least at one given point in time has been wholly worn away within at least one region by mask erosion while the microstructure is not yet wholly realized. Use can be made of a combination of ‘vertical’ erosion, i.e. parallel to the thickness direction and ‘horizontal’ erosion, i.e. perpendicularly of the thickness direction, of the mask layer. The horizontal mask erosion occurs at the edges of the mask structure.

Abstract: Measurement device (10) for taking a liquid sample, comprising: a measurement portion (15) with a measurement surface (20), for being in use contacted with the liquid surface and a plug portion (40) having a plurality of electrical contacts (50), wherein the plug portion (40) is mountable to a socket (110) of a measurement evaluation apparatus (100).