Abstract: A method for conditioning polishing pads for the simultaneous double-side polishing of semiconductor wafer uses a double-side polishing device. The device has an annular lower polishing plate and an annular upper polishing plate, each covered with a polishing pad, as well as a rolling device for carrier disks. The method for conditioning polishing pads includes disposing at least one conditioning tool having external teeth and at least one spacer having external teeth in a working gap formed between the first and second polishing pad, where the thickness of at least one of the conditioning tools differs from the thickness of at least one of the spacers. At least one conditioning tool and one spacer are set, simultaneously, in a revolving movement about the axis of the rolling device and in rotation themselves so as to generate material abrasion of at least one of the polishing pads.

Abstract: A method of polishing a semiconductor wafer includes simultaneous double-side polishing the wafer in a gap of a polishing device between a lower polishing plate covered with a lower polishing pad and upper polishing plate covered with an upper polishing pad while supplying a polishing agent. A first of the upper and lower polishing pads is dressed using a dressing tool. The dressing tool is mounted in the gap so that it extends from the inner edge to the outer edge of the first polishing pad. The distance between the dressing tool and a second of the upper and lower polishing pads at the inner edge of the second polishing pad differs from a corresponding distance at the outer edge of the second polishing pad. After the dressing, the at least one semiconductor wafer in the gap is polished.

Abstract: A method of polishing a semiconductor wafer includes simultaneous double-side polishing the wafer in a gap of a polishing device between a lower polishing plate covered with a lower polishing pad and upper polishing plate covered with an upper polishing pad while supplying a polishing agent. A first of the upper and lower polishing pads is dressed using a dressing tool. The dressing tool is mounted in the gap so that it extends from the inner edge to the outer edge of the first polishing pad. The distance between the dressing tool and a second of the upper and lower polishing pads at the inner edge of the second polishing pad differs from a corresponding distance at the outer edge of the second polishing pad. After the dressing, the at least one semiconductor wafer in the gap is polished.

Abstract: A method for conditioning polishing pads for the simultaneous double-side polishing of semiconductor wafer uses a double-side polishing device. The device has an annular lower polishing plate and an annular upper polishing plate, each covered with a polishing pad, as well as a rolling device for carrier disks. The method for conditioning polishing pads includes disposing at least one conditioning tool having external teeth and at least one spacer having external teeth in a working gap formed between the first and second polishing pad, where the thickness of at least one of the conditioning tools differs from the thickness of at least one of the spacers. At least one conditioning tool and one spacer are set, simultaneously, in a revolving movement about the axis of the rolling device and in rotation themselves so as to generate material abrasion of at least one of the polishing pads.

Abstract: Various embodiments provide a scheduling system structured for generating at least one posting to fill a vacant post on a schedule. In an embodiment, the scheduling system includes a scheduling database and an automated rotation tool. The scheduling database includes a personnel roster and a schedule. The schedule includes a vacant post. The scheduling database transmits the schedule and the personnel roster to the automated rotation tool. The automated rotation tool includes a computer system, and receives the personnel roster and the vacant post beginning within the vacancy window from the scheduling database, and also receives a rule, a parameter, and a vacancy window. The automated rotation tool generates a posting assigning a person from the personnel roster to the vacant post according to the rule and the parameter, and transmits the posting to the scheduling database.

Abstract: Various embodiments provide a scheduling system structured for generating at least one posting to fill a vacant post on a schedule. In an embodiment, the scheduling system includes a scheduling database and an automated rotation tool. The scheduling database includes a personnel roster and a schedule. The schedule includes a vacant post. The scheduling database transmits the schedule and the personnel roster to the automated rotation tool. The automated rotation tool includes a computer system, and receives the personnel roster and the vacant post beginning within the vacancy window from the scheduling database, and also receives a rule, a parameter, and a vacancy window. The automated rotation tool generates a posting assigning a person from the personnel roster to the vacant post according to the rule and the parameter, and transmits the posting to the scheduling database.