Abstract: A description is given of a method and a device (1) for providing (replicating) a patterned resyntetic resin relief (37) on the surface (25) of a glass substrate (27). For this purpose, a UV-curable acrylate lacquer (33) is applied to the surface (25), after which a transparent mould (3) having a relief (13) is rolled-off over the surface (25). By means of a UV light source (17) and an elliptic mirror (21), the lacquer is cured at the location of the focal line (23), thereby forming said relief (37). The relief (13) of the mould (3) is replicated on the glass substrate (27). The method described enables a relief of small dimensions (10.times.10 .mu.m) to be seamlessly provided on a large fiat surface (1.times.1 m), without being hindered by large release forces.

Abstract: A semiconductor device having two PIN-diodes arranged in series and in opposition, in which the semiconductor body comprises two surface zones of a first conductivity type which extend in a high-ohmic surface layer, said surface layer separating the surface zones from one another and from a low-ohmic region of the second conductivity type. The surface zones and the low-ohmic region are contacted at the same surface of the semiconductor body, preferably by means of beam leads. The device is particularly suitable for high frequency applications and may form part of an integrated circuit.