Abstract: The present invention relates to a method for making a global LED lamp (10) having a transparent globe (14) and a base (12) for connecting to a lamp socket. By wrapping the base (12) in expansive foam tape (38) of Compriband type or similar, prior to inserting it in a neck shaped portion (16) of the globe (14), automatic alignment of the base (12) in the globe neck (16) may be obtained. Further, soft metal strips (36) may be wrapped about the tape (38) prior to wrapping the tape (38) about the base (12). The tape (38) acts as an inflatable cushion, which presses the metal strips (36) towards the base (12) and the globe (14). Improved heat transfer between the globe (14) and the base (12) may thus be obtained.

Abstract: An ultrasound transducer (10) comprises an application specific integrated circuit (ASIC) (14), an array of acoustic elements (20), and a pitch independent interposer (12). The ASIC (14) includes a plurality of contact pads (16) on a surface of the ASIC that are separated from adjacent ones thereof by a first pitch. The acoustic elements (22) of the array (20) are separated from adjacent ones thereof by a second pitch. In addition, the pitch independent interposer (12) features a plurality of conductive elements (26) separated from adjacent ones thereof by a third pitch different from both the first pitch and the second pitch.

Abstract: A microelectronic package (31) has a microelectronic device, which is encapsulated in a quantity of material (27), and a lead frame element (15) for enabling the microelectronic device to be electrically contacted from outside of the package (31). The lead frame element (15) comprises at least two elongated members (11) comprising electrically conductive material and a filling material (12) comprising electrically insulating material, wherein the members (11) are partially embedded in the filling material (12). The lead frame element (15) is manufactured by providing elongated members (11), positioning the members (11) according to a predetermined configuration, providing filling material (12) to spaces (13) which are present between the members (11), and possibly removing portions of the filling material (12) and the members (11) in order to expose the electrically conductive material of the members (11).

Abstract: The present invention relates to a method for making a global LED lamp (10) having a transparent globe (14) and a base (12) for connecting to a lamp socket. By wrapping the base (12) in expansive foam tape (38) of Compriband type or similar, prior to inserting it in a neck shaped portion (16) of the globe (14), automatic alignment of the base (12) in the globe neck (16) may be obtained. Further, soft metal strips (36) may be wrapped about the tape (38) prior to wrapping the tape (38) about the base (12). The tape (38) acts as an inflatable cushion, which presses the metal strips (36) towards the base (12) and the globe (14). Improved heat transfer between the globe (14) and the base (12) may thus be obtained.

Abstract: Disclosed herein is a method for producing an LED array grid including the steps of (i) arranging N electrically conducting parallel wires, where N is an integer>1, thus creating an array of wires having a width D perpendicular to a direction of the wires, (ii) arranging LED components to the array of wires such that each LED component is electrically coupled to at least two adjacent wires, (iii) stretching the array of wires such that the width D increases, and arranging the stretched LED array grid onto a plate or between two plates.

Abstract: The present invention relates to a method for manufacturing an electronic assembly (50) comprising an electronic component, a cavity and a substrate which method comprises; —providing an electronic component (10) having a first pattern with a substantially closed configuration; —providing a cover (18) on a surface of the electronic component, which cover together with said surface defines a cavity (20), the closed configuration of the first pattern substantially enclosing the cover at said surface; —providing a substrate (30) having a second pattern with a substantially closed configuration, which closed configuration at least partially corresponds to the closed configuration of the first pattern and comprises a solder pad; —disposing solder material at the solder pad; —positioning the electronic component and the substrate so as to align both the substantially closed configurations of the first and second pattern, while the substrate supports a top surface (28) of the cover; —reflow-soldering the solder mate

Abstract: An ultrasound transducer 10 comprises an application specific integrated circuit (ASIC) 14, an array of acoustic elements 20, and a pitch independent interposer 12. The ASIC 14 includes a plurality of contact pads 16 on a surface of the ASIC that are separated from adjacent ones thereof by a first pitch. The acoustic elements 22 of the array 20 are separated from adjacent ones thereof by a second pitch. In addition, the pitch independent interposer 12 features a plurality of conductive elements 26 separated from adjacent ones thereof by a third pitch different from both the first pitch and the second pitch.

Abstract: A microelectronic package (31) has a microelectronic device, which is encapsulated in a quantity of material (27), and a lead frame element (15) for enabling the microelectronic device to be electrically contacted from outside of the package (31). The lead frame element (15) comprises at least two elongated members (11) comprising electrically conductive material and a filling material (12) comprising electrically insulating material, wherein the members (11) are partially embedded in the filling material (12). The lead frame element (15) is manufactured by providing elongated members (11), positioning the members (11) according to a predetermined configuration, providing filling material (12) to spaces (13) which are present between the members (11), and possibly removing portions of the filling material (12) and the members (11) in order to expose the electrically conductive material of the members (11).

Abstract: The frame (1) comprises an intermediate layer (5) sandwiched between a first layer (3) with a first pattern and a second layer (4) with a second pattern. Adhesion layers (2,12) are present on the first and second layer (3,4) respectively. The patterns are defined such that bumping portions (31) and a cap (21) are defined. The intermediate layer (5) is continuous and extends over spaces (25) between bumping portions (31) and the cap (21), so as to prevent disintegration. The frame is assembled to a device (50) with an electronic element (52), such as a MEMS element. The cap (21) then encapsulates a cavity (60) over the element (52).

Abstract: A carrier substrate (100) with laser sources includes a transparent center substrate (20), an upper substrate (30) adhered to the center substrate having openings (40) formed therein to expose the center substrate on a first side, and a lower substrate (32) adhered to the center substrate on a second side opposite the first side and having openings (42) formed therein to expose the center substrate on the second side, the openings on the lower substrate corresponding to positions of the openings in the upper substrate. Frequency conversion elements (60) are disposed on the center substrate within the openings of the lower substrate. Laser dies (70) are aligned to the frequency conversion elements and coupled to the lower substrate to provide light though the frequency conversion elements and the center substrate during operation. Methods for fabrication are also disclosed.

Abstract: The present invention relates to a method for manufacturing an electronic assembly (50) comprising an electronic component, a cavity and a substrate which method comprises; —providing an electronic component (10) having a first pattern with a substantially closed configuration; —providing a cover (18) on a surface of the electronic component, which cover together with said surface defines a cavity (20), the closed configuration of the first pattern substantially enclosing the cover at said surface; —providing a substrate (30) having a second pattern with a substantially closed configuration, which closed configuration at least partially corresponds to the closed configuration of the first pattern and comprises a solder pad; —disposing solder material at the solder pad; —positioning the electronic component and the substrate so as to align both the substantially closed configurations of the first and second pattern, while the substrate supports a top surface (28) of the cover; —reflow-soldering the solder mate

Abstract: An X-ray filter comprises an array of filter elements (5) an control circuit, the control circuit comprising an array of switching devices (33) provided on a common substrate (52), a switching device (33) being provided for each filter element for switching a control signal to the respective filter element. An output terminal of each switching device is provided with an external connection portion (54) located at the respective switching device. An array of external connection portions (54) is thus provided over the array of switching devices (33). The connection portions are then bonded to a connection block of the array of filter elements. This avoids the need to use edge connections of the substrate (52), and provides a secure mechanical and electrical connection between the control circuit and the filter array.

Abstract: The X-ray examination apparatus includes an X-ray source, an X-ray detector and an X-ray filter which is located between the X-ray source and the X-ray detector. The X-ray filter includes elements, notably capillary tubes, and the X-ray absorptivity of separate filter elements is adjustable by adjustment of a quantity of X-ray absorbing liquid in the respective filter elements. The quantity of X-ray absorbing liquid in the individual filter elements is adjusted by way of electric voltages applied to the individual filter elements. A control system is provided to apply the electric voltages selectively to the individual filter elements. The control system includes voltage lines and switching elements which electrically couple the filter elements to an electric voltage source. The filter elements are formed by spaces between corrugated plates or parallel plates provided with separating members, such as protrusions which extend transversely of the plates. The voltage lines are disposed on the plates.

Abstract: An X-ray examination apparatus of this invention comprises an X-ray source, an X-ray detector and an X-ray filter which is located between the X-ray source and the X-ray detector. The X-ray filter includes filter elements, notably capillary tubes, and the X-ray absorption of separate filter elements can be controlled by controlling a quantity of X-ray absorbing liquid in the respective filter elements. The quantity of X-ray absorbing liquid in the individual filter elements is controlled by way of electric voltages applied to the individual filter elements. The filter elements are formed as spaces between deformed foils which are arranged in a stack which is expanded in the direction transversely of the foils. Adjacent foils are locally attached to one another along seams. The stack is arranged between rigid plates and buffer elements are provided between the rigid plates and the stack. The buffer elements are contractable in the direction transversely to the direction of expansion of the stack.

Abstract: The invention relates to a hybrid RC element and to a simple method of manufacturing such an element. The inventive hybrid RC element comprises a capacitor body and a resistor body. Said element is characterized in that it includes a block-shaped, ceramic capacitor body which is provided with a contact layer on two parallel surfaces, and in that a block-shaped, ceramic resistor body is provided on one of said contact layers, the surface of the resistor body facing away from the capacitor body also being provided with a contact layer. The resistor body is preferably made from doped Si. The inventive hybrid RC element is very suitable for applications in which the element is exposed to high voltage pulses (1 kV or more). Unlike the known hybrid RC elements, the element in accordance with the invention is not subject to short-circuits under these conditions.

Abstract: A method of producing a multilayer piezoelectric element. The multilayer is formed of layers of piezoelectric synthetic resin material, such as PVDF and metal layers, such as Al. The multilayer is made form-retaining and mechanically stable by use of heat and pressure. Connections are provided on two facing sides of the multilayer which preferably include at least one sprayed metal layer, which preferably consists of the same metal as the metal layers of the multilayer.