Abstract: A cooling device for an electronic component is specified, which is built up from a stack (1) of profiled plates (2a; 2b) lying on one another and connected to one another and, at the end of the stack, termination plates (3) are provided in the stacking direction (x), at least one of the termination plates (3) being designed to make extensive contact with the electric component. Furthermore, at least one of the profiled plates (2a) has a flexible extension (4), the extension (4) projecting beyond the cross section of the stack (1). In addition, a cooling system with at least two such cooling devices is disclosed.

Abstract: A cooling device for an electronic component is specified, which is built up from a stack (1) of profiled plates (2a; 2b) lying on one another and connected to one another and, at the end of the stack, termination plates (3) are provided in the stacking direction (x), at least one of the termination plates (3) being designed to make extensive contact with the electric component. Furthermore, at least one of the profiled plates (2a) has a flexible extension (4), the extension (4) projecting beyond the cross section of the stack (1). In addition, a cooling system with at least two such cooling devices is disclosed.

Abstract: A converter circuit arrangement is specified which is constructed to have a particularly low inductance. This is achieved by the circuit area of the commutation circuit being kept as small as possible. A circuit area which is as small as possible is achieved by the branch modules and switch modules of a phase module being arranged either in a U-shape or in a meandering shape. The branch modules can be arranged either parallel to or at right angles to a main direction, between the positive and negative connections and the load connection. In addition, it is advantageous if the power semiconductor switches and the reverse-connected parallel diodes and freewheeling diodes are arranged in separate stacks which are held together by means of a clamping-in device.