Abstract: In a chip transferring apparatus a wafer (44) and a lead frame (50) are positioned. A first chip (42) is picked up from the wafer (44) by a transfer head (14; 40a-40d) in a chip pick-up position, while bonding a second chip to the lead frame (50) by another transfer head in a chip bonding position. The first chip (42) is then transferred by said one of the transfer heads from the chip pick-up position to the chip bonding position. Next, the first chip (42) is bonded on the lead frame (50) by said one of the transfer heads (14; 40a-40d) in the chip bonding position, while another one of the transfer heads picks up a third chip from the wafer (44) in the chip pick-up position. Each transfer head (14; 40a-40d) comprises a collet (66a-66d) which, through a mechanical coupling, is coupled to another collet for compensating radial forces exerted on the collet relative to said axis of rotation.

Abstract: The invention relates to a method of packaging an electronic component (1), preferably a semiconductor device (1), whereby the component (1) is positioned in a cavity (3) of a foil (4) by tweezers (2) and is supported or fixed by means of a further foil (5) which is attached to the foil (4) at one side thereof. According to the invention, the component (1) is first placed (2) into the cavity (3) of the foil (4) by the tweezers, and only after that is the further foil (5) positioned adjacent thereto and attached to the foil (4). In this way, the tweezers (2) can be moved through the foil (4) in order to pick up the component (1), hold it, and move it into the cavity (3). The method thus requires only little space and can be performed fast and reliably.