Abstract: The invention relates to a microelectronic device, particularly to a magnetic biosensor (10) which comprises a magnetic field generator, e.g. a bonding wire (16), extending in a sample chamber (5) a distance (d) away from a reaction surface (14) of a substrate (15). In a preferred embodiment, the device comprises a magnetic sensor element, e.g. a GMR sensor (12), for detecting magnetized particles (2) bound to specific binding sites (3) at the reaction surface (14). Moreover, it may comprise integrated magnetic excitation wires (11, 13) for generating a magnetic excitation field (B) at the reaction surface (14). In a particular application of the device (10), the stringency of the binding of magnetic particles can be tested by generating an inhomogeneous magnetic manipulation field (Bman) with the magnetic field generator (16) in the sample chamber (5).

Abstract: A method for manufacturing a large area LED array, comprising providing two stacks (21) of electrodes (26), each electrode arranged in a meander pattern (4) on a substrate (3), at least two U-turns (7) on one side of the meander each being connected to a LED mounting surface (8) to form a row (9) of mounting surfaces, arranging the stacks so that rows and columns of mounting surfaces intersect each other at a plurality of intersection points (24), and mounting LEDs (22) at these intersection points. The substrate material is then removed, and the stacks are stretched in two directions thereby separating said intersection points (24) from each other. According to the invention, the LEDs can be mounted to the LED mounting surfaces when these are still located close to each other, preferably adjacent to each other enabling a simple and cost efficient mounting process. Further, the size of the substrates on which the conducting layer is formed can be limited.

Abstract: A light emitting diode (LED) apparatus for mounting to a heat sink having a front surface with an opening therein is disclosed. The apparatus includes a sub-mount, at least one LED die mounted on the sub-mount, and a thermally conductive slug having first and second areas. The first area is thermally coupled to the sub-mount and the second area has a post protruding outwardly therefrom. The post is operably configured to be received in the opening in the heat sink and to secure the LED apparatus to the heat sink such that the second area is thermally coupled to the front surface of the heat sink. Other embodiments for mounting an LED apparatus utilizing adhesive thermally conductive material, spring clips, insertion snaps, or welding are also disclosed.

Abstract: The present invention relates to a fluid sample transport device (1) with reduced dead volume for processing, controlling and/or detecting a fluid sample (3), comprising: a substrate (2), wherein the upper surface of said substrate (2) comprises at least one processing, controlling and/or detecting element (19); at least one flexible membrane (4), wherein the flexible membrane (5) is arranged on the upper surface of said substrate (2); at least one plunger (5) and/or actuating element (9) for actuating an up and/or down movement of the flexible membrane (4) to cause a fluid flow and/or to stop a fluid flow; at least one cover plate (6) arranged on the upper outer surface or lower outer surface of the flexible membrane (4), wherein the cover plate (6) comprises at least one through going hole (10) and/or cut-out (10) for receiving a plunger (5) and/or actuating element (9), so that movement of said plunger (5) and/or actuating element (9) causes a pump and/or valve action of the adjacent arranged flexible memb

Abstract: Disclosed herein is a method for producing an LED array grid including the steps of (i) arranging N electrically conducting parallel wires, where N is an integer >1, thus creating an array of wires having a width D perpendicular to a direction of the wires, (ii) arranging LED components to the array of wires such that each LED component is electrically coupled to at least two adjacent wires, (iii) stretching the array of wires such that the width D increases, and arranging the stretched LED array grid onto a plate or between two plates

Abstract: A light emitting module (19), comprising at least one semi-conductor light source (20a-c) capable of emitting light, and a light-modifying member (21) arranged adjacent to the at least one semiconductor light source (20a-c) in a direction of emission of the light. The light-modifying member (21) is formed by a stacked sheet element (21) separated from an integral stacked sheet structure comprising first and second stacked sheets, so that the stacked sheet element (21) includes first and second sheet portions of the first and second stacked sheets, and at least the first sheet portion is configured to modify the emitted light. By providing the light-modifying member as a stacked sheet element which has been separated from an integral stacked sheet structure, batch manufacturing of the light-modifying member and/or the light emitting module is enabled, such that manufacturing steps requiring manual labor, or use of expensive equipment may be performed to produce the integral stacked sheet structure.

Abstract: A package enclosing at least one microelectronic element (60) such as a sensor die and having electrically conductive connection pads (31) for electric connection of the package to another device is manufactured by providing a sacrificial carrier; applying an electrically conductive pattern (30) to one side of the carrier; bending the carrier in order to create a shape of the carrier in which the carrier has an elevated portion and recessed portions; forming a body member (45) on the carrier at the side where the electrically conductive pattern (30) is present; removing the sacrificial carrier; and placing a microelectronic element (60) in a recess (47) which has been created in the body member (45) at the position where the elevated portion of the carrier has been, and connecting the microelectronic element (60) to the electrically conductive pattern (30). Furthermore, a hole (41) is arranged in the package for providing access to a sensitive surface of the microelectronic element (60).

Abstract: The invention relates to a method of manufacturing a microsystem and further to such microsystem. With the method a microsystem can be manufactured by stacking pre-processed foils (10) having a conductive layer (11a,11b) on at least one side. After stacking, the foils (10) are sealed, using pressure and heat. Finally the microsystems are separated from the stack (S). The pre-processing of the foils (preferably done by means of a laser beam) comprises a selection of the following steps: (A) leaving the foil intact, (B) locally removing the conductive layer, (C) removing the conductive layer and partially evaporating the foil (10), and (D) removing both the conductive layer as well as foil (10), thus making holes in the foil (10). In combination with said stacking, it is possible to create cavities, freely suspended cantilevers and membranes. This opens up the possibility of manufacturing various microsystems, like MEMS devices and microfluidic systems.

Abstract: The invention relates to a method of manufacturing a MEMS capacitor microphone and further to such MEMS capacitor microphone. With the method a MEMS capacitor microphone can be manufactured by stacking pre-processed foils (10) having a conductive layer (11a,11b) on at least one side. After stacking, the foils (10) are sealed, using pressure and heat. Finally the MEMS capacitor microphones are separated from the stack (S). The pre-processing of the foils (preferably done by means of a laser beam) comprises a selection of the following steps: (A) leaving the foil intact, (B) locally removing the conductive layer, (C) removing the conductive layer and partially evaporating the foil (10), and (D) removing both the conductive layer as well as foil (10), thus making holes in the foil (10). In combination with said stacking, it is possible to create cavities and membranes. This opens up the possibility of manufacturing MEMS capacitor microphone.

Abstract: A device (1) for testing a fluid comprises an elongated carrier (3); two foam members (5a, 5b) for absorbing the fluid, which are arranged at an end (4) of the carrier (3); a positioning member (6) comprising a sleeve (7) which is slidably arranged on the carrier (3); and a diagnostic device (2), which is arranged in the positioning member (6), and which comprises a sensor die (40) adapted to detecting at least one property of the fluid and means for supplying the fluid to a sensitive surface of the sensor die (40). After the fluid has been supplied to the foam members (5a, 5b), the positioning member (6) is moved towards the end (4) of the carrier (3) where the foam members (5a, 5b) are located. When the diagnostic device (2) comes into contact with one of the foam members (5a, 5b), the fluid is squeezed from the foam member (5a) and supplied to the sensitive surface of the sensor die (40), through the fluid supplying means of the diagnostic device (2).

Abstract: The invention relates to a method of manufacturing a microsystem and further to such microsystem. With the method a microsystem can be manufactured by stacking pre-processed foils (10) having a conductive layer (11a, 11b) on at least one side. After stacking, the foils (10) are sealed, using pressure and heat. Finally the microsystems are separated from the stack (S). The pre-processing of the foils (preferably done by means of a laser beam) comprises a selection of the following steps: (A) leaving the foil intact, (B) locally removing the conductive layer, (C) removing the conductive layer and partially evaporating the foil (10), and (D) removing both the conductive layer as well as foil (10), thus making holes in the foil (10). In combination with said stacking, it is possible to create cavities, freely suspended cantilevers and membranes. This opens up the possibility of manufacturing various microsystems, like MEMS devices and microfluidic systems.

Abstract: The present invention provides a packed semiconductor sensor chip (10) in which the sensing circuit (17) is positioned at substantially the same level or above the level of the packaging (13). Because of this, when the sensor is immersed in a fluid, in particular in a liquid, for the detection of an analyte in the fluid, substantially the total top surface of the semiconductor sensor chip will be in contact with the fluid and thus detection results can be optimised.

Abstract: The invention relates to an optoelectronic input device (10) in which the input is formed by detected movements of an object (M), the device comprising an optical module (11) comprising at least one laser (1,1?) with a cavity for the generation of a measuring radiation beam (S), optical means (2) for the guidance of the radiation beam (S) to a plane (V) close to the object (M) and conversion means (C) for the conversion of measuring beam radiation reflected and modulated by the object into an electrical signal, wherein the conversion means (C) are formed by a combination of the cavity of the laser (1) and measuring means (3) for measuring a change in the cavity during operation, which radiation is caused by reflected radiation entering the cavity.