Abstract: The electrowetting cell (15) comprises an outer wall (90) and an inner wall (80), said outer wall (90) being provided with extensions (85, 86) extending at opposing sides of the inner wall (80). The cell (15) is further provided with a membrane (45) for volume expansion and is sealed through an electroplated layer (95).

Abstract: The electrowetting cell (15) comprises an outer wall (90) and an inner wall (80), said outer wall (90) being provided with extensions (85,86) extending on opposing sides of the inner wall (80). The cell (15) is further provided with a membrane (45) for volume expansion and is sealed through an electroplated layer (95).

Abstract: A method of manufacturing a collection of variable focus lenses comprising two electrodes (21, 22) and a fluid chamber filled with two fluids which are separated by a meniscus, wherein the shape of the meniscus is variable under the influence of a voltage, comprises the following steps: providing an electrically insulating body (60) having a plurality of through-holes (14, 65); applying electrically conducting material to a surface of the body (60) in order to obtain the electrodes (21, 22); covering at least one of the obtained electrodes (21, 22) by a layer of electrically insulating material; covering an inner surface of a part of the through-holes (14) with a hydrophobic material; partially sealing these through-holes (14); arranging the fluids inside the partially sealed through-holes (14); completely sealing the through-holes (14); and dividing the body (60) into portions, such that each portion constitutes a complete lens.

Abstract: The sensing device (100) comprises a first sensing element (10) having a reference plane (1), between which sensing element (10) and a contacting side (3) of the device (100) a predefined angle is present. Conductors couple the sensing element (10) to external contacting means (30). The sensing device (100) is further provided with a body (21), which encapsulates the first sensing element (10) and at the same time acts as a carrier for the conductors, so that the contacting side (3) is a face of the body (21). The sensing device (100) may contain more than one sensing element (10,20), which are by preference magneto-resistive sensors. It can be suitably manufactured in that parts (21 A, 21 B) of the body are rotated with respect to the contacting side (3), the parts (21 A, 21 B) of the body having complementary shapes.

Abstract: The device has a carrier and an electric element. The carrier has a first and an opposed side and is provided with an connection layer, an intermediate layer and contact pads. The element is present at the first side and coupled to the connection layer. It is at least partially encapsulated by an encapsulation that extends into isolation areas between patterns in the intermediate layer. A protective layer is present at the second side of the carrier, which covers an interface between the contact pads and the intermediate layer.

Abstract: The device of the invention comprises a semiconductor element, a first connection element, a first patterned electrically conductive layer and a second patterned electrically conductive layer. The device is further provided with an encapsulation that encapsulates all except the first conductive layer, which is part of the substrate. The device can be suitably made in that the second conductive layer is provided, in pre-patterned form, with a permeable isolating layer as a foil.

Abstract: Provided is a device, an assembly comprising said device, a sub-assembly and an element suitable for use in the assembly. The device comprises a body of an electrically insulating material having a first side and an opposite second side, the body being provided with conductors according to a desired pattern, said conductors being anchored in the body. The body is provided with a through-hole extending from the first side to the second side of the body and having a surfacial area which is smaller on the first side than on the second side. Such a device can very suitably be used in an assembly comprising an element which is a sensor, preferably a chemical sensor, and particularly a biosensor.

Abstract: The invention relates to an opto-electronic input device (10), wherein the input is formed by detected movements of an object (M), which opto-electronic input device is provided with an optical module (11) comprising at least one laser (1) mounted on a carrier plate (4), which laser emits a radiation beam (S) that is guided to a plate (V) close to the object (M) and, after reflection therefrom, causes a change in the resonant cavity of the laser (1) which is representative of the movement of the object (M), and which is measured within the module (11).

Abstract: An electrowetting cell including an expandable joint between a body section and an end section. Such an expandable joint could include a membrane or a flange-like portion.

Abstract: The electronic device (100) comprises a semiconductor element (1) (e.g. a transistor), an encapsulation (5) and an electrically conductive layer (3) with a first and a second contact pad (11,12), used as signal pads, and a third contact pad (13) used as ground pads. Due to the shape of the contact pads (11,12,13), the spacing (200) is continuous, with a small entrance in between of the first and second contact pads (11,12). Consequently, the parasitic inductance is reduced and the device (100) is suitable for use at frequencies below and above 30 GHz, particularly up to 40 GHz.

Abstract: The electronic product comprises a body with a three-dimensional shape that is derived from the product. The body is provided with a pattern of conductors including contact pads and at least one electric element, in which the conductors are mechanically anchored in the body. It is preferably provided with attachment means for any carrier or external component. The pattern of conductors is primarily provided at the surface of the body. Conductors can be hidden inside the body, by removing in that area a releasable layer attached to the conductors before instead of after the molding process.

Abstract: Method suitable for transferring an electronic component (2??) supported by a carrier (3) to a desired position on a substrate (1). The carrier supporting the component is moved relative to the substrate whilst the component is present on a side of the carrier facing towards the substrate, until the component is positioned opposite the desired position on teh substrate. Then a light beam (4) is directed at the carrier (3), at the location of the component (2??), from a side remote from the substrate, as a result of which a connection between the component and the carrier is broken and the component is transferred from the carrier to the substrate.

Abstract: The device for mobile communication comprises a first and a second camera (41, 42), which are faced towards opposite sides of the device (2A, 2C). The cameras (41, 42) each comprise an optical lens (40) and a photosensitive semiconductor device (30). The lens (40) and the semiconductor device (30) are assembled together with a carrier body (2) which is provided with an aperture (20) between the lens (40) and the semiconductor device (30). The carrier body (2) is preferably provided with a pattern of conductive tracks (1) which extends from a first side (2A) to an opposite side (2C) of the body. The two cameras may have the same carrier body (2). The device for mobile communication further comprises a display, means for switching either one of the cameras and the projection of images thereof on the display on or off, as well as means for standing the device on a surface.

Abstract: A method of manufacturing an electronic device (10) is proposed that comprises an insulating body (2) with at a surface a conductive pattern (1). According to the invention, a carrier (3) is provided with a first layer (4) and a second layer (5), which layers (4, 5) comprise different materials. After reshaping of the carrier (3) from the side of the second layer (5), insulating material (2) is provided at the side of the second layer (5), and the first layer (4) is removed, therewith providing the insulating body (2) with the conductive pattern (1). The reshaping may be done, for example, by bending or by forcing. The resulting body (2) is very suitable for use in modules, as part of a compact camera. Its shape may be defined with a mold.

Abstract: The invention relates to a method of manufacturing a semiconductor device (10), whereby an electric element (11) is attached on or above a carrier plate (4) which comprises a first layer (5) of a first material and a second layer (2) of a second material which differs from the first, which is electrically conducting, which has a smaller thickness than the first layer (5), and in which a cavity (6) is formed that extends at least to the first layer (5). The element (11) is electrically connected to parts (2) of the carrier plate (4) at first connection regions (1), and an encapsulation is deposited around the element (11) and in the cavity (6). Then so much of the first layer (5) of the carrier plate (4) is removed that the cavity (6) is reached, whereby second connection conductors (2) are formed from the remaining portion of the carrier plate (4).

Abstract: The invention relates to an electric insulating body (2) provided with a conductor pattern (1) and an electronic device (10) comprising such a body (2) and at least one electronic element (30). According to the invention, the body (2) has first and second faces (2A, 2B) in between of which an angle of less than 180 degrees is defined, wherein the conductor pattern (1) of the body (2) extends over both faces (2A, 2B), which body (2) carries both the conductor pattern (1) and the electronic element (30). The conductor pattern (1) comprises strip-shaped regions (1A) and regions (1B) with a larger width than the strip-shaped regions (1A), which regions (1B) are suitable for electrically contacting the electronic element (30). The electronic element (30) is, for example, a camera. The device (10) with such a camera is particularly suitable for use in a mobile communication apparatus.

Abstract: The invention relates to a method of manufacturing a semiconductor device (10), wherein a semiconductor element (1) provided with a number of connection regions (2) is fitted between a first, electroconductive plate (3) and a second plate (4), wherein two connection conductors (3A, 3B) are formed, from the first plate (3), for the two connection regions (2A, 2B) of the element (1), wherein a passivating encapsulation (5) is provided between the plates (3, 4) and around the element (1), and wherein the device (10) is formed by applying a mechanical separating technique in two mutually perpendicular directions (L, M). In a method according to the invention, the connection conductors (3A, 3B) are formed by providing a mask (6) on the first conducting plate (3) in such a manner that a part (3C) of the plate (3) situated between the connection regions (2A, 2B) remains exposed, which part is subsequently removed by etching.

Abstract: The electronic device (100) comprises an electrical element (30), for instance a MEMS capacitor or a BAW filterin a cavity (37) that is protected from the environment by a cover (38). The cover (38) is a patterned layer which is mechanically embedded in isolating material (7) present beside the cavity (37) and may further include contact pads (41). The device (100) may be suitably manufactured from an accurately folded foil including a patterned layerand a sacrifice layer. After applying the foil to the cavity (37) the isolating material (7) is provided and the sacrifice layer is removed. The patterned layer, or part thereof, stays behind and forms the cover (38).

Abstract: The electronic device (100) comprises a body (20) with a cavity (30) wherein a semiconductor element (10) and a thermally conductive layer (33) are present. The cavity (30) is filled with an encapsulation (35) of an electrically insulating material wherein contact faces (47, 48) are mechanically anchored.

Abstract: A semiconductor device (100) comprising a semiconductor substrate (20) and a functional element (31), such as a microstrip, an inductor, a coupler or the like, is provided. Herein the functional element (31) is—at least partially—present in a conductive patterned layer that is mechanically embedded in isolating material (40) and that is connected to the substrate (20) through connection means. In this way, electrical losses through the substrate (20) are substantially reduced. The device (100) is provided in that a foil comprising the patterned layer and a carrier layer is applied to the substrate (20), after which the space between them is filled with the isolating material (40) and the carrier layer is removed.