Patents by Inventor Johji Kagami

Johji Kagami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Soldering method
    Publication number: 20070170227
    Abstract: An object of the invention is to provide a high-quality soldering method, by reducing, to a vacuum, the pressure in a vacuum room (2) in which a workpiece (10) having solid solder placed thereon consisting solely of tin or including tin and one or more components selected from silver, lead, copper, bismuth, indium and zinc is disposed. A free-radical gas is generated to remove an oxide film on the solder, and, after that, the generation of the free-radical gas is stopped, and the temperature of the solder is raised to a temperature above the melting point of the solder to melt the solder in the non-oxidizing atmosphere.
    Type: Application
    Filed: February 16, 2005
    Publication date: July 26, 2007
    Inventors: Yasuhide Ohno, Takashi Nakamori, Makoto Suenaga, Tatsuya Takeuchi, Johji Kagami, Taizo Hagihara
  • Reflow soldering method
    Patent number: 6935553
    Abstract: A soldering method includes exposing a solder paste including a solder powder and a flux on a member to a free radical gas and heating the solder paste to reflow the solder paste and vaporize any active components in the solder paste. Any flux residue is free of active components, so it is not necessary to perform cleaning after soldering to remove flux residue.
    Type: Grant
    Filed: April 15, 2003
    Date of Patent: August 30, 2005
    Assignees: Senju Metal Industry Co., Ltd., Shinko Seiki Co., Ltd.
    Inventors: Tadatomo Suga, Keisuke Saito, Yoshikazu Matsuura, Tatsuya Takeuchi, Johji Kagami, Rikiya Kato, Sakie Yamagata
  • Reflow soldering method
    Publication number: 20040007610
    Abstract: A soldering method includes exposing a solder paste including a solder powder and a flux on a member to a free radical gas and heating the solder paste to reflow the solder paste and vaporize any active components in the solder paste. Any flux residue is free of active components, so it is not necessary to perform cleaning after soldering to remove flux residue.
    Type: Application
    Filed: April 15, 2003
    Publication date: January 15, 2004
    Inventors: Tadatomo Suga, Keisuke Saito, Yoshikazu Matsuura, Tatsuya Takeuchi, Johji Kagami, Rikiya Kato, Sakie Yamagata