Patents by Inventor Johji Nakamoto

Johji Nakamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Metal plating process
    Patent number: 7704365
    Abstract: In order to make plating thickness uniform in a metal plating apparatus, a metal plating apparatus capable of performing metal plating to a uniform thickness is provided by aligning lines of electric force uniformly and in parallel by disposing a pair of conductive perforated plates 20a and 20b, which are electrically connected to each other, between plating metals 16 immersed in a plating solution and an object 18 to be plated.
    Type: Grant
    Filed: June 28, 2007
    Date of Patent: April 27, 2010
    Assignee: International Business Machines Corporation
    Inventors: Johji Nakamoto, Tatsuji Yamada
  • METAL PLATING APPARATUS AND PROCESS
    Publication number: 20080041726
    Abstract: In order to make plating thickness uniform in a metal plating apparatus, a metal plating apparatus capable of performing metal plating to a uniform thickness is provided by aligning lines of electric force uniformly and in parallel by disposing a pair of conductive perforated plates 20a and 20b, which are electrically connected to each other, between plating metals 16 immersed in a plating solution and an object 18 to be plated.
    Type: Application
    Filed: June 28, 2007
    Publication date: February 21, 2008
    Inventors: Johji Nakamoto, Tatsuji Yamada
  • Metal plating apparatus and process
    Patent number: 6827827
    Abstract: In order to make plating thickness uniform in a metal plating apparatus, a metal plating apparatus capable of performing metal plating to a uniform thickness is provided by aligning lines of electric force uniformly and in parallel by disposing a pair of conductive perforated plates 20a and 20b, which are electrically connected to each other, between plating metals 16 immersed in a plating solution and an object 18 to be plated.
    Type: Grant
    Filed: May 24, 2001
    Date of Patent: December 7, 2004
    Assignee: International Business Machines Corporation
    Inventors: Johji Nakamoto, Tatsuji Yamada
  • Metal plating apparatus and process
    Publication number: 20040079644
    Abstract: In order to make plating thickness uniform in a metal plating apparatus, a metal plating apparatus capable of performing metal plating to a uniform thickness is provided by aligning lines of electric force uniformly and in parallel by disposing a pair of conductive perforated plates 20a and 20b, which are electrically connected to each other, between plating metals 16 immersed in a plating solution and an object 18 to be plated.
    Type: Application
    Filed: December 4, 2003
    Publication date: April 29, 2004
    Applicant: International Business Machines Corporation
    Inventors: Johji Nakamoto, Takuji Yamada
  • Metal plating apparatus and process
    Publication number: 20010054556
    Abstract: In order to make plating thickness uniform in a metal plating apparatus, a metal plating apparatus capable of performing metal plating to a uniform thickness is provided by aligning lines of electric force uniformly and in parallel by disposing a pair of conductive perforated plates 20a and 20b, which are electrically connected to each other, between plating metals 16 immersed in a plating solution and an object 18 to be plated.
    Type: Application
    Filed: May 24, 2001
    Publication date: December 27, 2001
    Applicant: International Business Machines Corporation
    Inventors: Johji Nakamoto, Tatsuji Yamada
  • Method of metal-plating electrode portions of printed-wiring board
    Patent number: 5766492
    Abstract: A method of metal-plating electrode portions of a printed-wiring board includes copper-plating the overall surface of the printed-wiring board on which an electric circuit has been formed, forming a metal plating resist coating on the copper plated wiring board except for on the electrode portions, and subjecting the electrode portions, which are not covered with the resist coating, to an electrolytic metal plating process, at least once, and then removing the remaining resist coating. The resist coating formation and the electrolytic metal plating process may optionally be repeated a predetermined number of times. An etching resist coating is then formed on the circuit portion including the electrode portions, and the copper-plated portion is then removed except from the circuit portion by etching and then stripping the etching resist coating.
    Type: Grant
    Filed: May 28, 1996
    Date of Patent: June 16, 1998
    Assignees: Nippon Paint Co., Ltd., International Business Machines Corporation
    Inventors: Toshiya Sadahisa, Johji Nakamoto, Kanji Nishijima, Yoshinobu Kurosaki