Abstract: A method of recycling a lithium-ion battery, having a lithium-based cathode material deposited on a metallic cathode collector and an anode material deposited on a metallic anode collector, includes the steps of isolating an individual battery cell from a lithium-ion battery, and mechanically segmenting the battery cell into a plurality of pieces. The resulting segments are heated in an inert, dry atmosphere to a temperature below the melting point of the metallic components of the cell. Once cooled, the lithium-based cathode material is separated from the cathode collector in a first separation operation. A subsequent second separation operation separates the cathode collector from the anode collector.

Abstract: A method is provided for removing malodorous compounds, such as trimethylamine (TMA), present in an exhaust gas. At least one low-voltage electron beam energy source is used to remove small quantities of malodorous compounds in air. The electron beam energy source can also be used to beneficially form ozone to enhance the EB reduction of small quantities of compounds such as TMA in air.

Abstract: The present invention features new etchants to be utilized in the etching, depositing and growth processes for fabricating integrated circuits. The etchants contain a new family of compounds consisting of a single molecule. The molecule contains several halogen atoms, thus eliminating the need to add chlorine compounds in admixture with fluorine etchant materials. The new materials provide selectivity in the etching and deposition processes, as well as high product yield with high throughput. The etchants of this invention consist of a single amine molecule containing both fluorine and another halogen atom, consisting of chlorine or bromine, which are attached covalently to a nitrogen base atom. The basic formula for the molecule of this invention is given by: ##STR1## where: Z=chlorine or brominey=1 or 2;x=1 or 2; andx+y=3.

Abstract: The present invention is directed to a method for plasma desmear and etchback of epoxy and polyimide materials from a multilayered or double sided printed circuit board using a plasma gas composition in the range of 20-45% NF.sub.3, the remainder being O.sub.2.