Abstract: A method of forming a multi-layer circuit board or card. The method includes the step of forming a plurality of conductive planes. The conductive planes include ground, signal, or power planes. At least one through hole is formed through at least one of the conductive planes. An electrically conductive material is deposited onto an inside surface of the at least one through hole to form a plated through hole. At least one thermal relief passage is formed at least in the at least one of the conductive planes for preventing the diffusion of heat throughout the circuit board or card during the securing or removal or chips or other components to the circuit board or card by heating the material deposited in the at least one through hole to a temperature above its melting point. The at least one thermal relief passage is located in the vicinity of the at least one through hole and is free from electrical connection therewith.

Abstract: A multi-layer printed circuit board or card including at least one passage in at least one of the layers of the circuit board or card for preventing the diffusion of heat throughout the circuit board or card during the securing or removal of components in plated through holes in the circuit board or card by the heating of the plating material to a temperature above a melting point of the plating material.

Abstract: A coronary sinus catheter for the retrograde infusion of cardioplegia solutions into the coronary sinus. The catheter is adapted for improved retention in the coronary sinus. The catheter comprises a catheter tube having infusion, pressure-sensing and balloon-inflation lumens, an inflatable balloon and a pressure sensor tube in fluid communication with the balloon-inflation lumen for sensing pressure in the inflatable balloon. The internal volume of the pressure sensor tube is relatively non-expansible relative to the internal volume of the inflation balloon in normal operation of the catheter. Other aspects of the invention include a constricted portion in the infusion lumen that is believed to eliminate spraying of fluid through the infusion lumen outlet(s), and a temperature sensor strip providing a display on the catheter of the temperature of the infused fluid.

Abstract: Disclosed is a method of reworking a circuit panel, and a reworked circuit panel structure. The method includes providing a conformal, polymeric, dielectric coating or coatings on the surface of the panel, providing conductive circuitization atop the conformal, polymeric, dielectric coating or coatings on the surface of the panel, and providing a top conformal, polymeric, dielectric coating atop the conductive circuitization layer. Also disclosed is a rerouted circuit panel having at least two surface features that are connected by a rerouted current lead. The current lead is formed of a dielectric encapsulated conductor electrically joining the two surface features. The dielectric encapsulated conductor structure includes a conformal, polymeric dielectric bottom layer adherent to a surface of the circuit board, with a provided conductor on the conformal, polymeric dielectric layer, and a conformal, polymeric dielectric layer provided atop the provided conductor.