Abstract: A novel materials technology has been developed and demonstrated for providing a high modulus composite material for use to 1000° F. and above. This material can be produced at 5-20% of the cost of refractory materials, and has higher structural properties. This technology successfully resolves the problem of “thermal shock” or “ply lift,” which limits traditional high temperature laminates (such as graphite/polyimide and graphite/phenolic) to temperatures of 550-650° F. in thicker (0.25″ and above) laminates. The technology disclosed herein is an enabling technology for the nose for the External Tank (ET) of the Space Shuttle, and has been shown to be capable of withstanding the severe environments encountered by the nose cone through wind tunnel testing, high temperature subcomponent testing, and full scale structural, dynamic, acoustic, and damage tolerance testing.

Abstract: A novel materials technology has been developed and demonstrated for providing a high modulus composite material for use to 1000.degree. F. and above. This material can be produced at 5-20% of the cost of refractory materials, and has higher structural properties. This technology successfully resolves the problem of "thermal shock" or "ply lift," which limits traditional high temperature laminates (such as graphite/polyimide and graphite/phenolic) to temperatures of 550-650.degree. F. in thicker (0.25" and above) laminates. The technology disclosed herein is an enabling technology for the nose for the External Tank (ET) of the Space Shuttle, and has been shown to be capable of withstanding the severe environments encountered by the nose cone through wind tunnel testing, high temperature subcomponent testing, and full scale structural, dynamic, acoustic, and damage tolerance testing.

Abstract: This invention relates to a foam, a foam-resin composite and a method of making foam-resin composites. The foam set forth in this invention comprises a urethane modified polyisocyanurate derived from an aromatic amino polyol and a polyether polyol. In addition to the polyisocyanurate foam, the composite of this invention further contains a resin layer, wherein the resin may be epoxy, bismaleimide, or phenolic resin. Such resins generally require cure or post-cure temperatures of at least 350.degree. F.