Abstract: A two-phase reduction method for producing tantalum powder includes loading an unheated reaction vessel with a layer of K2TaF7, then a layer of solid sodium metal, and then followed by a layer of solid diluent salt. A first heating phase is used to promote the solid state reduction of the layer of K2TaF7, which results in the production of very fine tantalum particles while minimizing tantalum crystal growth. A second heating phase is then used to melt the contents of the reactor vessel and react primary quantities of sodium metal and K2TaF7 to produce tantalum powder. In certain embodiments, the fine tantalum particles produced during the first heating phase serve as the nucleation sites needed for tantalum crystal growth in the second heating phase.

Abstract: An active clamp device electrically couples first and second nodes in respective first and second supply domains referenced to ground potentials that can be different. The active clamp device comprises first and second active devices controlled by signals respectively referenced to the first and second supply domains that create a short-circuit or low impedance connection between the first and second nodes in normal operation and drive impedance between the first and second nodes high in response to a transient event.

Abstract: Porous microparticles of high-purity tantalum may be processed in a vacuum plasmatron using a hollow cathode and spraying apparatus in which the coolant is in the form of a metal surface. In one embodiment, the initial powder of tantalum is introduced through a coaxial hole in a hollow cathode and supplied to a vertical column of plasma by inert gas and exposed to heating to temperatures close to the melting point of tantalum. The atomizing tantalum particles are directed through a hole in the anode and collide with a rotating inclined tantalum substrate and cooled from within water, thereby flattened and solidifying the particles.

Abstract: A power converter is configured for usage in a power factor correction system. The power converter comprises a transformer with a primary winding and a secondary winding which isolates a primary side from a secondary side. A primary side switch is coupled to the primary winding. An isolator coupled to the primary side switch isolates the primary side from the secondary side and comprises a signal pathway passing a digital signal from the primary side to the secondary side. Power factor correction circuitry is coupled to the primary side switch and adjusts electric load characteristics to improve power factor toward unity.

Abstract: A power over Ethernet (PoE) system has a reclassification functionality. The illustrative PoE system comprises a powered device (PD) and a power sourcing equipment (PSE) communicatively coupled to the PD. A classification identification component coupled to the PD encodes a classification value. A classification identification component can typically be implemented as a classification resistor, although any other suitable component such as a capacitor, inductor, register, or other structure or method can otherwise be implemented. The PoE system can further comprise a reclassification register in a non-volatile memory that stores a value indicative of a new classification state and a new classification identifier and a power switch that powers the powered device to a classification voltage.

Abstract: A current-mode controller comprises an inductance element, at least one semiconductor switch coupled to the inductance element, and a ramp compensator coupled to sense an indication of current through the inductance element and coupled to control the at least one semiconductor switch that senses current during on-time of the DC-DC converter, infers current during off-time of the DC-DC converter, and determines a slope compensation signal based on the sensed and inferred currents.

Abstract: A network device comprises an interface coupling an electronic device to a differential pair of signal lines, and an integrated active common mode suppression and electrostatic discharge protection circuit coupled to the interface in parallel to differential signal lines of the electronic device. First and second resistors are respectively coupled to the differential lines between the integrated active common mode suppression and electrostatic discharge protection circuit and the electronic device.

Abstract: An electronic circuit in an integrated circuit package comprises an inductance element. The inductance element further comprises a plurality of separated metal strips formed on a substrate and a ferrite core coupled to the substrate. The metal strip plurality is formed between the substrate and the ferrite core. The inductance element further comprises a plurality of wires coupled to the separated metal strips whereby the metal strips and wires form a continuous coil. The ferrite core is interposed between the metal strip plurality and the wire plurality.

Abstract: Embodiments disclosed herein provide a network device comprises a transformer with a primary winding and a secondary winding. The primary winding is coupled to receive input signals from a network connector and supply data signals to a physical layer (PHY) module. An inductance boost circuit is coupled to the secondary winding and operable to increase the impedance of the primary winding. In other embodiments, a network device comprises an autotransformer coupled to receive input signals from a network connector and supply data signals to a physical layer (PHY) module. An electronic load coupled in parallel between the autotransformer and the PHY layer module.

Abstract: In a network device, a power potential rectifier is adapted to conductively couple a network connector to an integrated circuit that rectifies and passes a power signal and data signal received from the network connector. The power potential rectifier regulates a received power and/or data signal to ensure proper signal polarity is applied to the integrated circuit.

Abstract: Dynamic insertion insertion loss for an ethernet power on differential cable pairs is shown in a power feed circuit that supplies power to a network attached device (PD). An insertion loss control circuit limits power loss in a coupled power feed circuit. determines an insertion loss limit, and senses an average power of the power signals to produce a common mode feedback signal to the power feed circuit.

Abstract: A semiconductor device comprises an integrated circuit formed on a substrate with a signal interface and at least one isolator capacitor. The integrated circuit comprises a plurality of interleaved inter-metal dielectric layers and interlayer dielectrics formed on the substrate, a thick passivation layer formed on the plurality of the interleaved inter-metal dielectric layers and interlayer dielectrics, and a thick metal layer formed on the thick passivation layer. The thick passivation layer has a thickness selected to be greater than the isolation thickness whereby testing for defects is eliminated. The one or more isolator capacitors comprise the thick metal layer and a metal layer in the plurality of interleaved inter-metal dielectric layers and interlayer dielectrics separated by the thick passivation layer as an insulator.

Abstract: An interface comprises a converter configured to track process characteristics across an isolation barrier and modify amplitude of a fast differential edge modulation as a function of speed of an active device on a transmitting side of the isolation barrier, and a differentiator configured to differentiate the fast differential edge modulation on a receiving side of the isolation barrier whereby differentiation bandwidth tracks slope rate of the differential edge modulation.

Abstract: A network device comprises an Ethernet physical layer (PHY) comprising an isolation, protection, and electromagnetic interference suppression barrier operative for isolated power and data transfer.

Abstract: A signal isolator comprises an isolation barrier, a transmitter, a differentiator, and a recovery circuit. The transmitter is coupled to a first side of the isolation barrier and is configured to receive and convert an information signal to a differential signal that encodes information in the information signal in a single transition edge. The differentiator is coupled to a second side that is isolated from the first side of the isolation harrier and differentiates the differential signal. The recovery circuit is coupled to the differentiator and operates to recover an output information signal based on the information in the single transition edge.

Abstract: A method for transferring power and information across an isolation barrier comprises transferring power across a power transfer isolation barrier between a primary circuit and a secondary circuit while maintaining isolation between the primary and secondary circuits, and transferring data between the powered system and the isolated system across a communication isolation barrier that is distinct from the power transfer isolation barrier.

Abstract: An active clamp device electrically couples first and second nodes in respective first and second supply domains referenced to ground potentials that can be different. The active clamp device comprises first and second active devices controlled by signals respectively referenced to the first and second supply domains that create a short-circuit or low impedance connection between the first and second nodes in normal operation and drive impedance between the first and second nodes high in response to a transient event.

Abstract: A network interface apparatus is disclosed that includes a connector coupled to a plurality of communication lines. A Physical Layer (PHY) device coupled to the communication lines and to a first ground level. A transient event suppression module coupled between the communication lines and a low impedance path to earth ground. During a transient event the transient event suppression module provides a low impedance path to the earth ground to protect the PHY device from the transient event. A power circuit that delivers power from a second ground level to the PHY device is coupled to the first ground level. The first ground level and the second ground level are coupled to provide a low impedance path during normal operation and high impedance during transient events.

Abstract: Porous microparticles of high-purity tantalum may be processed in a vacuum plasmatron using a hollow cathode and spraying apparatus in which the coolant is in the form of a metal surface. In one embodiment, the initial powder of tantalum is introduced through a coaxial hole in a hollow cathode and supplied to a vertical column of plasma by inert gas and exposed to heating to temperatures close to he melting point of tantalum. The atomizing tantalum particles are directed through a hole in the anode and collide with a rotating inclined tantalum substrate and cooled from within water, thereby flattened and solidifying the particles.

Abstract: The production of tantalum powder having a low impurity level is provided by a method in which potassium heptafluotantalate is added to a mixture of alkali metal halides in reactor vessel in which the internal surface and auxiliary input accessories of the reactor are covered with a tantalum coating. In one embodiment, the production of tantalum powder with low impurity level includes depositing a protective tantalum coating onto an internal surface of the reactor vessel and auxiliary accessories of a reactor by electrolysis of a mixture of alkali metals halides and potassium heptafluotantalate.