Patents by Inventor John A. DeSantis

John A. DeSantis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5387111
    Abstract: A low-profile, high density, electrical connector (10), includes multiple layers (19, 22) of substantially parallel electrical conductors (31), the electrical conductors (25) each having a planar portion (29), and spaced ends (31) angling away from the planar portions (29). The planar portions (29) of the electrical conductors (25) are insulated with an insulating material (34). The spaced ends (31) of the electrical conductors (25) on each layer form a row of connector pins (13, 16). The connector (10) is formed by attaching the multiple layers (19, 22) along the insulated planar portions (29) of the conductors (25) to form a substantially rigid, low profile, multilayered structure.
    Type: Grant
    Filed: October 4, 1993
    Date of Patent: February 7, 1995
    Assignee: Motorola, Inc.
    Inventors: John A. DeSantis, Giovanni Jaramillo, David C. Everest, III
  • Patent number: 5244395
    Abstract: A circuit interconnect system comprises a circuit pattern (22) on a rigid insulating sheet (17), forming a first circuit carrying substrate (12). A portion of the circuit pattern wraps around an edge of the insulating sheet and continues onto a vertical wall (20) of the sheet to provide a contact surface (24). An electrically conductive portion (16) of a second member (14) is mated to the first circuit carrying substrate by aligning the contact surface to the electrically conductive portion. An electrically conductive resilient material such as a conductive elastomer (35) or metal spring (35) provides electrical interconnection between the circuit pattern and the electrically conductive portion.
    Type: Grant
    Filed: July 29, 1992
    Date of Patent: September 14, 1993
    Assignee: Motorola, Inc.
    Inventors: John A. DeSantis, Peter E. Albertson
  • Patent number: 5104754
    Abstract: The present invention provides for a battery pack (50) comprising a plurality of cells (58) within a housing (52), each cell having a positive and negative terminals (57 and 59). The battery pack (50) further comprises molded-in circuitry means (54) on the surface of the housing (52) for providing interconnection between the plurality of cells (58). Optionally, the housing (52) further comprises molded-in or integral spring fingers (56). The spring fingers (56) are preferably biased toward the positive and negative terminals and provide at least some interconnection for the plurality of cells (58).
    Type: Grant
    Filed: October 5, 1990
    Date of Patent: April 14, 1992
    Assignee: Motorola, Inc.
    Inventors: Dale W. Dorinski, Mark S. Bresin, Stephen D. Hunt, Mac W. Branan, Jr., John A. Desantis
  • Patent number: 5035173
    Abstract: An apparatus for the automatic, continuous popping of popcorn having an upper storage compartment, heating coils for providing heat inside the upper storage compartment, a popcorn popping kettle, a lower storage compartment housing electrical components, a corn supply, a salt supply and an oil supply. The apparatus preferably includes a vacuum source for directing a predetermined amount of corn and salt from their supplies into the popping kettle, and a submersible pump for delivering a predetermined amount of oil into the popping kettle.
    Type: Grant
    Filed: June 13, 1989
    Date of Patent: July 30, 1991
    Assignee: Six Corners Development Company
    Inventors: Andrew M. Stein, John A. DeSantis
  • Patent number: 4181385
    Abstract: Socket for use on a circuit board which can be eyeletted to secure the socket in fixed position on the board with the head of the socket engaging the board. The head is shaped, as with flat sides, so that a vent passage extends from the space for solder between the socket and the opening in the circuit board. The head has a top surface at a fixed height above the board, and has a tapered opening to receive a plug-in connector pin. The circuit board structure, with the socket soldered to the conductor on the inside surface of the opening in the circuit board, provides a good electrical connection to the socket.
    Type: Grant
    Filed: March 30, 1978
    Date of Patent: January 1, 1980
    Assignee: Motorola, Inc.
    Inventors: John A. DeSantis, Ellis J. Gottlieb