Patents by Inventor John A. Dromsky

John A. Dromsky has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4559089
    Abstract: A composite, light weight vehicular bumper material is disclosed which has a surface layer of stainless steel, a principal layer of a heat treatable aluminum and an intermediate layer of essentially commercially pure aluminum. The stainless steel provides the desired surface finish and durability; the surface can be flash chromed if desired to provide a suitable bright, specular appearance. The layer of heat treatable aluminum is the principal structural component and provides the high ratio of strength to weight needed for the application. The intermediate layer of pure aluminum serves as a transition zone between the principal and surface layers aiding in the development of the maximum bond strength between those two components. In its application the composite is heat treated to obtain desired mechanical strength characteristics.
    Type: Grant
    Filed: February 17, 1984
    Date of Patent: December 17, 1985
    Assignee: Texas Instruments Incorporated
    Inventors: John A. Dromsky, Charles H. Zenuk
  • Patent number: 4141029
    Abstract: An improved integrated circuit device includes a lead frame having a pad and having a plurality of lead members extending away from a location adjacent to the pad. The lead frame is blanked from a metal laminate which is formed by pressure bonding a layer of copper to each of two opposite sides of a layer of high chromium-low nickel stainless steel and which is annealed and then provided with a selected degree of work-hardening prior to blanking. The blanked lead frame surfaces are plated with an inner nickel plating and with an outer silverplating. An integrated circuit unit is mounted on the lead frame pad and terminals of the unit are connected to selected lead members. The pad, unit and portions of the lead members are encapsulated in a non-conductive organic material to permit ends of the lead members to extend from the encapsulation. The device displays an improved combination of technical properties in a low cost structure.
    Type: Grant
    Filed: December 30, 1977
    Date of Patent: February 20, 1979
    Assignee: Texas Instruments Incorporated
    Inventor: John A. Dromsky
  • Patent number: 3943011
    Abstract: A strip of composite metal laminate material embodying a thin inner layer of stainless steel sandwiched between and metallurgically bonded to two relatively thicker outer layers of low carbon steel is subjected to a brief, high temperature heat treatment followed by a relatively much longer heat treatment at much lower temperature for substantially eliminating the yield point in the laminate and for maximizing formability of the laminate while permitting some reduction in the corrosion resistance properties of the stainless steel layer of the laminate. The composite strip material is then readily formed into two, concentrically disposed convolutions of the strip material while the laminate material is in this highly formable condition.
    Type: Grant
    Filed: August 31, 1973
    Date of Patent: March 9, 1976
    Assignee: Texas Instruments Incorporated
    Inventor: John A. Dromsky