Patents by Inventor John A. Eisele

John A. Eisele has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6512198
    Abstract: A method for forming a nozzle plate for an ink jet printer by laser ablation wherein topographical features are formed by laser ablation and additional ablation pulses are applied to remove debris from the nozzle plate.
    Type: Grant
    Filed: May 15, 2001
    Date of Patent: January 28, 2003
    Assignee: Lexmark International, Inc
    Inventors: Pete John Eisele, Brian Christopher Hart, Colin Geoffrey Maher
  • Publication number: 20020170894
    Abstract: A method for forming a nozzle plate for an ink jet printer by laser ablation wherein topographical features are formed by laser ablation and additional ablation pulses are applied to remove debris from the nozzle plate.
    Type: Application
    Filed: May 15, 2001
    Publication date: November 21, 2002
    Inventors: Pete John Eisele, Brian Christopher Hart, Colin Geoffrey Maher
  • Patent number: 5900831
    Abstract: This disclosure relates to dielectric chaff materials or fibers which are small in character for packing and expandable on release to produce clouds of great cross section. Polymer materials are treated chemically and/or irradiated with nuclear or electronic radiation which partially decomposes the polymer. Upon release, the polymer is heated to create gas bubbles from within which expand the dielectric fibers to change the density and shape of the dielectric.
    Type: Grant
    Filed: March 26, 1974
    Date of Patent: May 4, 1999
    Inventors: John A. Eisele, Robert M. Mason, Francis J. Campbell
  • Patent number: 3964155
    Abstract: A method of mounting silicon solar cells in a planar array that not only lds electrical insulation between cells but allows for a multifold increase in thermal dissipation of the cell array, comprising metallizing a wafer of beryllium oxide on each side so that the outer surface is copper, etching the wafer on one side so that the only metallized parts which remain are those on which the solar cells are to be mounted or wiring is to be attached, soldering the solar cells on the unetched copper prominences, coating the aluminum panel on which the cells are mounted with a copper layer, soldering the underside of the wafer on the upper surface of the aluminum panel with soft solder such as indium, and covering all remaining passive surfaces with a teflon F.E.P. tape the underside of which carries a layer of slver and then a layer of inconel metal.
    Type: Grant
    Filed: June 8, 1973
    Date of Patent: June 22, 1976
    Assignee: The United States of America as represented by the Secretary of the Navy
    Inventors: Charles Z. Leinkram, William D. Oaks, John A. Eisele, Bruce J. Faraday