Patents by Inventor John A. Goertz

John A. Goertz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHODS AND MEANS FOR AMPLIFICATION-BASED QUANTIFICATION OF NUCLEIC ACIDS
    Publication number: 20230366016
    Abstract: The invention relates to simplified means of using biological predictive relationships, in some instances reducing the determination of complex gene networks and relative expression patterns to a single reading.
    Type: Application
    Filed: October 7, 2021
    Publication date: November 16, 2023
    Inventors: John Goertz, Molly Stevens
  • Electronic device package with peripheral carrier structure of low-cost plastic
    Patent number: 4897602
    Abstract: An electronic device package on a lead frame with a peripheral carrier structure holding the distal ends of the leads in rigid position. The carrier structure is spaced apart from the package body and permits the package to be handled and tested while protecting the leads. A different, relatively lower quality and less expensive material is used for the carrier structure than for the package body to reduce the cost of the package since the carrier structure may comprise several times, for example four times or more, the volume of the package body.
    Type: Grant
    Filed: October 14, 1988
    Date of Patent: January 30, 1990
    Assignee: Motorola, Inc.
    Inventors: Paul T. Lin, Michael B. McShane, Charles G. Bigler, John A. Goertz, Joan M. Hamilton
  • Process of making an electronic device package with peripheral carrier structure of low-cost plastic
    Patent number: 4837184
    Abstract: An electronic device package on a lead frame with a peripheral carrier structure holding the distal ends of the leads in rigid position. The carrier structure is spaced apart from the package body and permits the package to be handled and tested while protecting the leads. A different, relatively lower quality and less expensive material is used for the carrier structure than for the package body to reduce the cost of the package since the carrier structure may comprise several times, for example four times or more, the volume of the package body.
    Type: Grant
    Filed: January 4, 1988
    Date of Patent: June 6, 1989
    Assignee: Motorola Inc.
    Inventors: Paul T. Lin, Michael B. McShane, Charles G. Bigler, John A. Goertz