Abstract: A method and system for conducting a web search. The method comprises the steps of receiving a language selection and a web page selection from a user; and translating said web page into said language, including translating a pull-down list of searchable fields, and for each said field, translating items on one or more selection lists, wherein a code is associated with each item. The method comprises the further steps of providing said translated web page to said user, including providing script enabling said user to select one of said searchable fields and one or more of said items; receiving the codes associated with the selected items, and performing a search in response thereto; and translating results from said search into said language, and providing the translated results to the user. Preferably, the translating step includes the step of converting the data structure of a date or an amount into the selected language.

Abstract: A method of forming electrical connections between a flexible film carrier and an electronic device (e.g., semiconductor chip). The method comprises the steps of aligning the film carrier relative to the device having a plurality of solder mounds located on an upper surface thereof. The film carrier is engaged such that bridging portions of conductive leads thereof physically contact these solder mounds. Hot gas is passed through a screen member to heat the bridging portions of the leads to cause these leads to in turn heat the solder mounds to cause the mounds to become molten, whereafter these leads and mounds are cooled to form the desired solder bonds. The resulting structure may form part of an electronic package, this package also described herein.

Abstract: A thin film electronic package which utilizes a circuitized substrate (e.g., a printed circuit board) having a flexible film carrier electrically coupled thereto. The film carrier includes a dielectric layer (e.g., polyimide) with first and second circuit layers located on opposite sides thereof. These circuit layers are interconnected, electrically, through the dielectric. An electronic device (e.g., semiconductor chip) is electrically connected to bridging portions of the conductive leads of the carrier's first circuit layer, which bridging portions extend across apertures provided within the dielectric. A plurality of solder elements are utilized to provide electrical connection between respective contact locations of the electronic device and respective bridging portions of the first layer's conductive leads.