Abstract: A data collection system for semiconductor manufacturing includes: T substrate processing tools, where each of the T substrate processing tools includes: N processing chambers, where each of the N processing chambers includes a processing chamber controller configured to receive a plurality of different types of data during operating of the corresponding one of the N processing chambers, where the plurality of different types of data have different formats, where the processing chamber controller is further configured to format the plurality of different types of data into formatted data, and where T and N are integers; and a data diagnostic services computer configured to: receive and store the formatted data as categories in a common file having a table-like data structure including rows with contextual data; and in response to a request, generate an output file including a subset of the data from the common file.

Abstract: A data collection system for semiconductor manufacturing includes: T substrate processing tools, where each of the T substrate processing tools includes: N processing chambers, where each of the N processing chambers includes a processing chamber controller configured to receive a plurality of different types of data during operating of the corresponding one of the N processing chambers, where the plurality of different types of data have different formats, where the processing chamber controller is further configured to format the plurality of different types of data into formatted data, and where T and N are integers; and a data diagnostic services computer configured to: receive and store the formatted data as categories in a common file having a table-like data structure including rows with contextual data; and in response to a request, generate an output file including a subset of the data from the common file.

Abstract: An automated process control system for controlling a plasma processing system having a chamber, for processing a substrate is disclosed. The automatic process control system includes a first sensor disposed within the chamber, for making a first plurality of measurements pertaining to a first parameter associated with a structure disposed at least partially within the chamber. The automatic process control system further includes first logic coupled to receive the first plurality of measurements from the first sensor. The first logic is configured for analyzing the first plurality of measurements during a test step. There is also included second logic coupled to receive a first signal from the first logic, the second logic being configured to stop the test step if the first signal indicates a fault.

Abstract: An automated process control system configured for controlling a plasma processing system having a chamber, the chamber being configured for processing a substrate. The automatic process control system includes a first sensor disposed within the chamber, the first sensor being configured for making a first plurality of measurements pertaining to a first parameter associated with a structure disposed at least partially within the chamber. The performing the first plurality of measurements is performed during the processing of the substrate. The automatic process control system further includes first logic coupled to receive the first plurality of measurements from the first sensor. The first logic is configured for analyzing using SPC methodologies the first plurality of measurements during the processing.

Abstract: An automated process control system configured for controlling a plasma processing system having a chamber, the chamber being configured for processing a substrate. The automatic process control system includes a first sensor disposed within the chamber, the first sensor being configured for making a first plurality of measurements pertaining to a first parameter associated with a structure disposed at least partially within the chamber. The performing the first plurality of measurements is performed during the processing of the substrate. The automatic process control system further includes first logic coupled to receive the first plurality of measurements from the first sensor. The first logic is configured for analyzing using SPC methodologies the first plurality of measurements during the processing.

Abstract: A compact, easy to store, portable fish cleaner device capable of removably attaching to the outside surface of the gunwale of a boat. The device includes a v-shaped trough member capable of holding a fish for cutting over the water along the outside surface of the boat. The trough member comprises two angled surfaces pivotally attached along one edge. The ends of the trough member are open and a drain gap is created between the angled surfaces so that fish entails and other waste material may be easily washed into the water. A plurality of support members are attached to the gunwale and support the trough member in place over the water. Support member attachment means are used to removably attach each support member to the outside surface of the gunwale. Hook and loop connectors are provided between the trough member and the support members to adjustably attach them together.

Abstract: A liquefied gas apparatus, in particular a gas lighter for smokers, is disclosed, utilizing a vaporizer-pressure reducer assembly including a pressure reducing device situated generally within a vaporizer. All solid materials with which the assembly is in contact have a thermal conductivity in the range 0.3 to 5 kcal/m/h/.degree. C.