Abstract: Parking assistance is provided to a driver by shifting the viewing perspective of cameras attached to the vehicle. Shifting the perspective is accomplished by capturing images of objects adjacent the vehicle to be parked, determining distances between the vehicle and objects adjacent the vehicle, creating a three-dimensional map of objects adjacent the vehicle, overlaying images of objects adjacent the vehicle onto the three-dimensional map, and creating a virtual three-dimensional representation of objects adjacent the vehicle.

Abstract: Devices and methods of the present invention are directed to positioning a patient in a prone position that exposes the posterior thoracic lumbar spine during a surgical procedure, such as a laminectomy procedure. The device has at least three support members, with a first support member configured and adapted to support at least a portion of a patient's torso and the patient's hips; a second support member, generally contiguous with the first, configured and adapted to contact a patient's thighs and to position the patient's thighs in a desired angular position relative to the patient's hips and torso; and a third support member, generally contiguous with the second support member, adapted to support a patient's knees and lower legs and to position the patient's lower legs in a desired angular position relative to the patient's torso and thighs.

Abstract: A power supply module has a printed circuit board (PCB) containing a plurality of electrical components for converting an input voltage to an output voltage. A heat sink is formed over substantially an entire surface area of the PCB for providing heat dissipation. The heat sink is made with a thermally conductive and electrically insulating polymer compound, such as liquid crystalline polymer or polyphenylene sulfide, which is injection molded to surface of the PCB. The heat sink can be formed on a front side and backside of the PCB and may have a plurality of posts for increasing the heat dissipating surface area of the heat sink. By disposing the heat sink over substantially the entire surface of the PCB, the heat sink is able to remove more heat and allow the power supply module to provide more output load current given the same physical size and ambient conditions.

Abstract: A packaging system for a high current, low voltage power supply. The power supply uses bare die power FETs which are directly mounted to a thermally conductive substrate by a solder attachment made to the drain electrode metallization on the back side of the FETs. The source electrode and gate electrode of each FET are coupled to the circuitry on an overhanging printed circuit board, using CSP solder balls affixed to the front side of the FET die. The heat generated by the FETs is effectively dissipated by the close coupling of the FETs to the thermally conductive underlying substrate.

Abstract: A packaging system for a high current, low voltage power supply. The power supply uses two bare die field effect transistors whose input and output electrodes are solder attached to low resistance, high current posts in the package. An associated controller chip is mounted to a rigid circuit board, and the circuit board is mechanically attached to the posts. The circuit board thereby gives physical rigidity to the package, but carries no high currents. The use of low resistance, high current posts reduces the heat generated, improving the long term reliability.

Abstract: A packaging system for a high current, low voltage power supply. The power supply uses bare die power FETs which are directly mounted to a thermally conductive substrate by a solder attachment made to the drain electrode metallization on the back side of the FETs. The source electrode and gate electrode of each FET are coupled to the circuitry on an overhanging printed circuit board, using CSP solder balls affixed to the front side of the FET die. The heat generated by the FETs is effectively dissipated by the close coupling of the FETs to the thermally conductive underlying substrate.