Abstract: The present invention, in one embodiment, provides a method for eliminating agglomerate particles in a polishing slurry. In this particular embodiment, the method is directed to reducing agglomeration of slurry particles within a waste slurry passing through a slurry system drain. The method comprises conveying the waste slurry to the drain, wherein the waste slurry may form an agglomerate having an agglomerate particle size. The method further comprises subjecting the waste slurry to energy emanating from an energy source. The energy source thereby transfers energy to the waste slurry to substantially reduce the agglomerate particle size. Substantially reduce means that the agglomerate is size is reduced such that the waste slurry is free to flow through the drain.

Abstract: The present invention provides a method for manufacturing an integrated circuit using a polishing head in a polishing apparatus. In one advantageous embodiment, the polishing head comprises a wafer carrier having an outer periphery and a wafer holder. The wafer holder is coupled to the wafer carrier and depends from the outer periphery thereof. The wafer holder is configured (i.e., designed) to grip an edge of the semiconductor wafer.

Abstract: The present invention provides a wafer cleaning apparatus. In an advantageous embodiment, the wafer cleaning apparatus includes cleaning brushes mounted within a brush box and a sensor associated with at least one of the cleaning brushes and configured to detect a degree of wetness of the at least one of the cleaning brushes. In most cases, the cleaning brushes are comprised of an absorbent material, such as polyvinyl alcohol, that becomes more compressible as the cleaning brushes become more wetted with a solution. Thus, a degree of compressibility can be related to a degree of wetness of a cleaning brush, which provides data that allows an operator to determine when the cleaning brushes are wet enough to send a wafer through the cleaning apparatus without incurring unnecessary damage.

Abstract: The present invention provides a method of manufacturing an integrated circuit using a cleaning brush and a cleaning brush conditioning apparatus. In one embodiment, the cleaning brush conditioning apparatus comprises a conditioning bar and a load cell coupled to the conditioning bar. The load cell is configured to force the conditioning bar against the cleaning brush.

Abstract: The present invention provides a polishing slurry reclamation system. In one embodiment, the polishing slurry reclamation system comprises a polishing apparatus having a polishing platen and a fluid delivery system positioned to deliver a slurry or a rinse to the polishing platen, a recovery drain adjacent the polishing platen, and a fluid diverter associated with the platen and configured to deflect a selected one of a slurry or rinse emanating from the polishing platen to the recovery drain.

Abstract: A method of cleaning a semiconductor wafer using a cleaning brush assembly having an arbor with: (1) an expandable member configured to have a non-expanded position and an expanded position, and (2) a cleaning brush, located about the expandable member, having an inner diameter greater than an outer diameter of the expandable member in the non-expanded position and less than an outer diameter of the expandable member in the expanded position.

Abstract: The present invention provides a polishing pad alignment device having an alignment member positionable against a side wall of a platen. The height of the alignment member is sufficient to extend above a top surface of the platen when positioned against the wall of the platen. In one embodiment, the alignment member is an arcuate member having an arc substantially equal to an arc of the platen. In another embodiment, the alignment member is removably attachable to the wall of the platen and the polishing pad alignment member further includes an attachment device configured to attach the alignment member to the platen.

Abstract: The present invention provides a wafer cleaning apparatus. In an advantageous embodiment, the wafer cleaning apparatus includes cleaning brushes mounted within a brush box and a sensor associated with at least one of the cleaning brushes and configured to detect a degree of wetness of the at least one of the cleaning brushes. In most cases, the cleaning brushes are comprised of an absorbent material, such as polyvinyl alcohol, that becomes more compressible as the cleaning brushes become more wetted with a solution. Thus, a degree of compressibility can be related to a degree of wetness of a cleaning brush, which provides data that allows an operator to determine when the cleaning brushes are wet enough to send a wafer through the cleaning apparatus without incurring unnecessary damage.

Abstract: /The present invention provides in one embodiment a method of manufacturing an integrated circuit including cleaning a semiconductor wafer using a cleaning apparatus, wherein the cleaning apparatus includes a roller brush frame and roller brushes cooperatively supported within the roller brush frame and aligned to form a cleaning gradient that is configured to remove particles of different sizes from an object to be cleaned.

Abstract: The present invention provides a polishing apparatus for use in polishing a substrate, including: (1) A polishing platen, and (2) a rotational strain sensor coupled to the polishing platen configured to detect a change in a rotational strain of the polishing platen during a polishing process. In addition, the present invention provides an accompanying method of detecting an endpoint during the polishing process by detecting a change between a first rotational strain and a second rotational strain with the rotational strain sensor.

Abstract: The present invention provides a semiconductor wafer cleaning brush assembly having an arbor with: (1) an expandable member configured to have a non-expanded position and an expanded position, and (2) a cleaning brush, locatable about the expandable member, having an inner diameter greater than an outer diameter of the expandable member in the non-expanded position and less than an outer diameter of the expandable member in the expanded position. The present invention further provides a method of replacing the cleaning brush of the assembly, and a method of cleaning a semiconductor wafer with such an assembly.

Abstract: The present invention provides a slurry delivery system comprising a slurry conduit couplable to a wall of the slurry tank, and configured to receive a slurry therein and deliver a stream of the slurry against an inner wall of the slurry tank. Thus, the system inhibits drying of a slurry within the slurry tank and minimizes agglomeration on the sides of the slurry tank that results from slurry drying on the sides of the slurry tank's wall when the slurry level within the tank rises and falls. This minimization of agglomeration reduces the agglomerates within the slurry supply, which in turn, reduces the number of contaminants and scratches affecting the overall quality of the semiconductor wafer substrate.

Abstract: The present invention, in one embodiment, provides a method for eliminating agglomerate particles in a polishing slurry. In this particular embodiment, the method is directed to reducing agglomeration of slurry particles within a waste slurry passing through a slurry system drain. The method comprises conveying the waste slurry to the drain, wherein the waste slurry may form an agglomerate having an agglomerate particle size. The method further comprises subjecting the waste slurry to energy emanating from an energy source. The energy source thereby transfers energy to the waste slurry to substantially reduce the agglomerate particle size. Substantially reduce means that the agglomerate is size is reduced such that the waste slurry is free to flow through the drain.

Abstract: The present invention provides a terminal block extension for use with a terminal block having electrical contacts and that is electrically coupled to a wiring system. In one embodiment, the terminal block comprises an insulating body having first and second coupling ends and a first conductor disposed within the insulating body having first and second conducting ends. The first coupling end is configured to mechanically couple to the terminal block. The second coupling end is configured to mechanically couple to another terminal block extension. The first conducting end is configured to couple to one of the electrical contacts. The second conducting end is configured to receive a first wire of the wiring system and cooperatively engage a first coupling end of another terminal block extension.

Abstract: The present invention provides a polishing apparatus comprising a carrier head having a periphery, a first region, a carrier ring, and a second region. The carrier ring is coupled to the periphery. The carrier ring and carrier head are configured to cooperatively receive an object to be polished. The first region is associated with the carrier head and is capable of manifesting a polarity proximate the carrier ring. The second region is associated with the carrier ring and is capable of manifesting the polarity proximate the first region. The first and second regions have like polarities that create a repelling force between the carrier head and the carrier ring.

Abstract: The present invention, in one embodiment, provides a method for eliminating agglomerate particles in a polishing slurry. In this particular embodiment, the method is directed to reducing agglomeration of slurry particles within a waste slurry passing through a slurry system drain. The method comprises conveying the waste slurry to the drain, wherein the waste slurry may form an agglomerate having an agglomerate particle size. The method further comprises subjecting the waste slurry to energy emanating from an energy source. The energy source thereby transfers energy to the waste slurry to substantially reduce the agglomerate particle size. Substantially reduce means that the agglomerate is size is reduced such that the waste slurry is free to flow through the drain.

Abstract: The present invention provides a method of manufacturing an integrated circuit using a conditioning wheel status indicator with a polishing apparatus having a conditioning wheel and a polishing pad. In one embodiment, the conditioning wheel status indicator comprises a drive motor, an ammeter, and an indicator. The drive motor is coupled to the conditioning wheel and configured to rotate the conditioning wheel against the polishing pad at a prescribed rotation rate. The ammeter is coupled to the drive motor and configured to measure a current of the drive motor. The current registered is a nominal current when the conditioning wheel is new. The indicator is coupled to the ammeter and configured to register an excess current that exceeds the nominal current when the conditioning wheel has incurred an undesirable degree of wear.

Abstract: The present invention provides a wafer carrier for use with a semiconductor wafer polishing apparatus. In one embodiment, the wafer carrier comprises a carrying head having opposing first and second surfaces, a primary channel system formed in the second surface, and a secondary channel system formed in the second surface. The first surface is coupleable to the semiconductor polishing apparatus and the second surface is adapted to receive a semiconductor wafer to be polished. The primary channel system comprises first and second intersecting channels. The secondary channel system intersects the primary channel system so that the secondary channel system and the primary channel system cooperate to occupy a substantial portion of a surface area of the second surface. Therefore, the primary channel system and the secondary channel system decrease an amount of force required to remove the semiconductor wafer from the second surface.

Abstract: The present invention provides a method of manufacturing a semiconductor device using a polishing apparatus having a polishing pad conditioning wheel. In one embodiment, the polishing pad conditioning wheel comprises a conditioning head, a setting alloy, an abrasive material, and a corrosion resistant coating. The conditioning head has opposing first and second faces with the first face being coupleable to the polishing apparatus. The setting alloy is coupled to the conditioning head at the second face, and the abrasive material is embedded in the setting alloy, which is substantially covered by the corrosion resistant coating.

Abstract: The present invention provides a method of manufacturing an integrated circuit using a polishing head in a semiconductor wafer polishing apparatus. The polishing head preferably comprises a wafer carrier head and a protuberance coupled to the wafer carrier head. The wafer carrier head has a back surface that contacts the wafer when it is positioned within the carrier head and a carrier ring depends from the carrier head to form an annulus. The annulus has an inner surface, which is typically an inner surface of the carrier ring, and it forms a cavity with the wafer carrier head that is configured to receive a semiconductor wafer therein. The protuberance is located within the annulus proximate the inner surface and is configured to cooperate with a concavity in a periphery of the semiconductor wafer. This cooperation prevents the semiconductor wafer from rotating with respect to the wafer carrier head during polishing of the semiconductor wafer.