Abstract: A wire holder device is disclosed. The wire holder device may have four main faces and one wire channel running across the main face. Wire holder members may have four wire channel sections, which may have different volumes, that may be a slot for holding a wire. Between the wire holder members may be an unframed base section, which may provide a platform for a wire tie.

Abstract: A wire holder device is disclosed. The wire holder device may have four main faces and one wire channel running across the main face. Wire holder members may have four wire channel sections, which may have different volumes, that may be a slot for holding a wire. Between the wire holder members may be an unframed base section, which may provide a platform for a wire tie.

Abstract: A process for manufacturing printed circuit boards having plated through-holes. An epoxy glass substrate is laminated on opposite surfaces by a thin copper foil and subsequently apertures are drilled through the laminated substrate where the plated through-holes are desired. The exposed surfaces of the apertures are electroless copper plated. Then by means of a photoresist, the desired circuit images and the apertures are exposed and the initial electroless copper plating is removed again. The apertures and the desired circuit images are again plated by electroless copper plating to establish an initial copper thickness. The apertures in the desired circuit images are then electro-copper plated to the approximate thickness of the photoresist and preferably so that their thickness is less than the thickness of the photoresist. The copper plating is then electro-solder plated.