Abstract: Embodiments of a polyethylene composition are provided, which may include a first polyethylene fraction comprising at least one peak in a temperature range of from 40 C to 75 C in an elution profile via improved comonomer composition distribution (iCCD) analysis method, where a first polyethylene area fraction is an area in the elution profile from 40 C to 75 C, and where the first polyethylene fraction area comprises from 45% to 65% of the total area of the elution profile; and a second polyethylene fraction comprising at least one peak in a temperature range of from 85 C to 110 C in the elution profile, where a second polyethylene area fraction is an area in the elution profile from 85 C to 110 C, and where the second polyethylene fraction area comprises from 15% to 35% of the total area of the elution profile, wherein the polyethylene composition has a density of 0.905 g/cm3 to 0.918 g/cm3, a melt index (I2) of 0.7 g/10 minutes to 3.

Abstract: A low-density polyethylene having a melt strength measured at 190 C that is greater than or equal to 5.5 cN, a density that is greater than or equal to 0.9210 g/cm3 and less than or equal to 0.9275 g/cm3, and, and a melt index I2 measured at 190° C. that is greater than or equal to 4.5 g/10 min.

Abstract: The present invention provides polymer blends that can be used in a multilayer structure and to multilayer structures including one or more layers formed from such blends. In one aspect, a polymer blend includes a copolymer including ethylene and at least one of acrylic acid and methacrylic acid having an acid content greater than 4 and up to 25 weight percent based on the weight of the copolymer and having a melt index (I.sub.2) of 1 to 60 g/10 minutes, wherein the total amount of ethylene acrylic acid copolymer and ethylene methacrylic acid copolymer includes 45 to 99 weight percent of the blend based on the total weight of the blend, and a polyolefin having a density of 0.870 g/cm.sup.3 or more and having a melt index (I.sub.2) of 20 g/10 minutes or less, wherein the polyolefin includes 1 to 55 weight percent of the blend based on the total weight of the blend.

Abstract: An electronic device comprises a first encapsulating film in direct contact with a light-receiving and transmitting film and a second encapsulating film in direct contact with a back sheet. The first encapsulating film has a zero shear viscosity greater than that of the second encapsulating film. The back sheet of the electronic device contains fewer bumps than the back sheet of a comparable electronic device having a first encapsulating film with a zero shear viscosity less than or equal to that of the second encapsulating film.

Abstract: Disclosed are multilayer film structures including a layer (B) that includes a crystalline block copolymer composite (CBC) or a specified block copolymer composite (BC), including i) an ethylene polymer (EP) including at least 80 mol % polymerized ethylene; ii) an alpha-olefin-based crystalline polymer (CAOP) and iii) a block copolymer including (a) an ethylene polymer block including at least 80 mol % polymerized ethylene and (b) a crystalline alpha-olefin block (CAOB); and a layer C that includes a polyolefin having at least one melting peak greater than 125 C, the top facial surface of layer C in adhering contact with the bottom facial surface of layer B. Such multilayer film structure preferably includes (A) a seal layer A having a bottom facial surface in adhering contact with the top facial surface of layer B. Such films are suited for use in electronic device (ED) modules including an electronic device such as a PV cell.

Abstract: A multilayer film structure including a top encapsulation layer A, a tie Layer B between top Layer A and bottom Layer C and a bottom layer C, the multilayer film structure characterized in that tie Layer B includes a crystalline block composite resin or a block composite resin and bottom Layer C includes a polyolefin having at least one melting point greater than 125 C.

Abstract: The present invention relates generally to vinylidene chloride polymer compositions. In one embodiment, a vinylidene chloride polymer composition comprises (a) a vinylidene chloride polymer formed from a monomer mixture comprising from 60 to 99 weight percent vinylidene chloride monomer and from 40 to 1 weight percent of a monoethylenically unsaturated monomer copolymerizable therewith; (b) 0.3 to 5 weight percent of an acrylic polymer based on the total weight of the polymer composition; and (c) 0.2 to 7 weight percent of at least one additive comprising (i) at least one wax in an amount of from 0.01 to 2 weight percent based on the total weight of the polymer composition, (ii) at least one polyethylene having a density greater than 0.940 g/cm3 in an amount of from 0.1 to 5 weight percent based on the total weight of the polymer composition, or combinations thereof.

Abstract: A multilayer encapsulant film having at least two layers includes a first layer comprising an encapsulant resin, and a second layer comprising an encapsulant resin and at least one down-converter, such as a rare-earth organometallic complex. The down-converter may be present in an amount of at least 0.0001 wt % based on the total weight of the encapsulant film. Further layers of a multilayer encapsulant film may or may not include a down-converter. Preferably, a multilayer encapsulant film contains at least one layer with at least one down-converter and at least one layer without a down-converter. Such multilayer down-converting films may be used in an electronic device, such as a PV module.

Abstract: An electronic device comprises a first encapsulating film in direct contact with a light-receiving and transmitting film and a second encapsulating film in direct contact with a back sheet. The first encapsulating film has a zero shear viscosity greater than that of the second encapsulating film. The back sheet of the electronic device contains fewer bumps than the back sheet of a comparable electronic device having a first encapsulating film with a zero shear viscosity less than or equal to that of the second encapsulating film.

Abstract: Disclosed are multilayer film structures comprising a layer (B) that comprises a crystalline block copolymer composite (CBC) or a specified block copolymer composite (BC), comprising i) an ethylene polymer (EP) comprising at least 80 mol % polymerized ethylene; ii) an alpha-olefin-based crystalline polymer (CAOP) and iii) a block copolymer comprising (a) an ethylene polymer block comprising at least 80 mol % polymerized ethylene and (b) a crystalline alpha-olefin block (CAOB); and a layer C that comprises a polyolefin having at least one melting peak greater than 125° C., the top facial surface of layer C in adhering contact with the bottom facial surface of layer B. Such multilayer film structure preferably comprises (A) a seal layer A having a bottom facial surface in adhering contact with the top facial surface of layer B. Such films are suited for use in electronic device (ED) modules comprising an electronic device such as a PV cell.

Abstract: A multilayer film structure comprising a top encapsulation layer A, a tie Layer B between top Layer A and bottom Layer C and a bottom layer C, the multilayer film structure characterized in that tie Layer B comprises a crystalline block composite resin or a block composite resin and bottom Layer C comprises a polyolefin having at least one melting point greater than 125° C.

Abstract: An electronic device comprises a first encapsulating film in direct contact with a light-receiving and transmitting film and a second encapsulating film in direct contact with a back sheet. The first encapsulating film has a zero shear viscosity greater than that of the second encapsulating film. The back sheet of the electronic device contains fewer bumps than the back sheet of a comparable electronic device having a first encapsulating film with a zero shear viscosity less than or equal to that of the second encapsulating film.

Abstract: The present invention provides polymer blends that can be used in a multilayer structure and to multilayer structures comprising one or more layers formed from such blends. In one aspect, a polymer blend comprises a copolymer comprising ethylene and at least one of acrylic acid and methacrylic acid having an acid content greater than 4 and up to 25 weight percent based on the weight of the copolymer and having a melt index (I2) of 1 to 60 g/10 minutes, wherein the total amount of ethylene acrylic acid copolymer and ethylene methacrylic acid copolymer comprises 45 to 99 weight percent of the blend based on the total weight of the blend, and a polyolefin having a density of 0.870 g/cm3 or more and having a melt index (I2) of 20 g/10 minutes or less, wherein the polyolefin comprises 1 to 55 weight percent of the blend based on the total weight of the blend.

Abstract: The present invention relates generally to methods of preparing vinylidene chloride polymer compositions. In one embodiment, a method of preparing a vinylidene chloride polymer composition comprises (a) adding a first dispersion comprising a wax, a polyolefin or a combination thereof to an aqueous dispersion comprising vinylidene chloride polymer particles; (b) adding an acrylic polymer latex to the aqueous dispersion; and (c) coagulating the wax, the polyolefin, or the combination of the wax and polyolefin, and the acrylic polymer on the surface of the polymer particles.

Abstract: An electronic device module comprises: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising an ethylene multi-block copolymer. Typically, the polyolefin material is an ethylene multi-block copolymer with a density of less than about 0.90 grams per cubic centimeter (g/cc). The polymeric material can fully encapsulate the electronic device, or it can be laminated to one face surface of the device. Optionally, the polymeric material can further comprise a scorch inhibitor, and the copolymer can remain uncrosslinked or it can be crosslinked.

Abstract: The present disclosure provides a photovoltaic module. In an embodiment, the photovoltaic module includes a photovoltaic cell, and a layer composed of a film. The film includes a silane-grafted polyolefin (Si-g-PO) resin composition comprising (i) one or more silane grafted polyolefins and (ii) from greater than 0 wt % to less than 5.0 wt % of a micronized silica gel, based on the total weight of the Si-g-PO resin composition. The film has a glass adhesion greater than or equal to 15 N/mm after aging the film at 40° C. and 0% relative humidity for 60 days as measured in accordance with ASTM F88/88M-09.

Abstract: An electronic device comprises a first encapsulating film in direct contact with a light-receiving and transmitting film and a second encapsulating film in direct contact with a back sheet. The first encapsulating film has a zero shear viscosity greater than that of the second encapsulating film. The back sheet of the electronic device contains fewer bumps than the back sheet of a comparable electronic device having a first encapsulating film with a zero shear viscosity less than or equal to that of the second encapsulating film.

Abstract: A multilayer encapsulant film having at least two layers includes a first layer comprising an encapsulant resin, and a second layer comprising an encapsulant resin and at least one down-converter, such as a rare-earth organometallic complex. The down-converter may be present in an amount of at least 0.0001 wt % based on the total weight of the encapsulant film. Further layers of a multilayer encapsulant film may or may not include a down-converter. Preferably, a multilayer encapsulant film contains at least one layer with at least one down-converter and at least one layer without a down-converter. Such multilayer down-converting films may be used in an electronic device, such as a PV module.

Abstract: Disclosed in more detail in this application are ethylene interpolymer films having one or more layers, comprising surface layer comprising: (A) a silane-containing ethylene interpolymer comprising (1) an ethylene interpolymer having a density of less than 0.905 g/cm3, and (2) at least 0.1 percent by weight alkoxysilane; characterized by: (3) having a volume resistivity of greater than 5×1015 ohm-cm as measured at 60 C. In one embodiment, such ethylene interpolymer has a residual boron content of less than 10 ppm and residual aluminum content of less than 100 ppm. Also disclosed are laminated electronic device modules comprising: A. at least one electronic device, and B. one of the ethylene interpolymer films as described above in intimate contact with at least one surface of the electronic device. Such laminated electronic device modules according to the invention have been shown to suffer reduced potential induced degradation (“PID”).

Abstract: A backsheet or frontsheet having an outer layer with a melting temperature greater than or equal to 150° C. includes at least one surface comprising a surface modification to improve adhesion between the backsheet or frontsheet and an encapsulant. The adhesion of the backsheet or frontsheet and encapsulant, after lamination, is at least 20 N/cm, preferably at least 40 N/cm or no adhesion failure. More preferably, the adhesion is at least 20 N/cm, even more preferably 40 N/cm or no adhesion failure, before and after 1,000 hours, preferably 2,000 hours, of damp heat aging at 85° C. and 85% humidity.