Abstract: A testing system operable to accurately position a plurality of contact electrodes relative to a plurality of electrical contacts is disclosed. For one embodiment, the testing system comprises a first imaging system coupled to a wafer chuck. The wafer chuck is used to place the electrical contacts of a wafer in contact with the plurality of electrodes. To facilitate accurate positioning between the wafer electrical contacts and the contact electrodes, the first imaging system is configured to locate the plurality of contact electrodes. The testing system also comprises a second imaging system configured to locate the wafer electrical contacts. An image generator coupled to the first imaging system generate an alignment image on a focal point of the first imaging system. The testing system calibrates the first imaging system to the second imaging system using the alignment image.

Abstract: A testing system operable to accurately position a plurality of contact electrodes relative to a plurality of electrical contacts is disclosed. For one embodiment, the testing system comprises a first imaging system coupled to a wafer chuck. The wafer chuck is used to place the electrical contacts of a wafer in contact with the plurality of electrodes. To facilitate accurate positioning between the wafer electrical contacts and the contact electrodes, the first imaging system is configured to locate the plurality of contact electrodes. The testing system also comprises a second imaging system configured to locate the wafer electrical contacts. An image generator coupled to the first imaging system generate an alignment image on a focal point of the first imaging system. The testing system calibrates the first imaging system to the second imaging system using the alignment image.

Abstract: A testing system operable to accurately position a plurality of contact electrodes relative to a plurality of electrical contacts is disclosed. For one embodiment, the testing system comprises a first imaging system coupled to a wafer chuck. The wafer chuck is used to place the electrical contacts of a wafer in contact with the plurality of electrodes. To facilitate accurate positioning between the wafer electrical contacts and the contact electrodes, the first imaging system is configured to locate the plurality of contact electrodes. The testing system also comprises a second imaging system configured to locate the wafer electrical contacts. An image generator coupled to the first imaging system generate an alignment image on a focal point of the first imaging system. The testing system calibrates the first imaging system to the second imaging system using the alignment image.

Abstract: An improved illumination method and apparatus for optical character recognition. A first light source is positioned such that light emitted from it strikes the surface at an angle of incidence. A detector is placed at the angle of reflection, such that specularly reflected light strikes the detector, providing bright field illumination. Additional light sources positioned at angles different from the first light source are disclosed to provide for high and low angle dark field illumination. Novel light guides which allow for a compact and economic system design are also disclosed. The disclosed system utilizes light sources and filters which greatly reduce the effect of environmental lighting on the optical character recognition process. A novel method to select the optimum light source and intensity is also disclosed.

Abstract: Light is supplied via a optical fiber to a probe head. The light exiting the optical fiber is focused to a point by a lens. Reflected light from an object at or near the focal point is reflected back through the lens and then focused to the source optical fiber or a second optical fiber located next the source optical fiber. The return signal is then detected in a detector module. By noting the characteristics of the response curve as the object is moved back and forth relative to the probe head, the position of the object can be determined. By performing this procedure over several points, a detailed topography map can be created. Additionally, the probe head can be scanned at a constant distance from the surface to produce an image of the surface as the response signal varies according to the surface's reflectivity.

Abstract: An optical system with feedback control of the pulse energy of an attenuated laser pulse output by the system having a laser, attenuators, and a servo control subsystem. The attenuators include a beam attenuator module within the servo loop for variable adjustment of laser beam attenuation, and a plurality of light absorbing filters outside of the servo loop which can be selectively switched into or out of the beam path for further attentuation by known fixed amounts. A Brewster window, a photodiode and associated electronics sample the beam following attentuation by the beam attenuator module, and deliver a feedback signal to a microprocessor. The microprocessor compares the feedback signal and a used input desired pulse energy, then causes the beam attenuator module to adjust the amount attenuation so that the output beam energy is maintained within about five percent of the desired energy.