Patents by Inventor John A. Rabenius

John A. Rabenius has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050087661
    Abstract: An apparatus and method are provided for mounting a flat screen television on a vertically oriented surface. The apparatus includes a mounting assembly that attaches to the back of the television and is lifted and slidably inserted in position on a wall mount assembly. The mounting assembly adapts to different sized mounting screws, permits the orientation of the television to be adjusted to square the television with the ceiling, and permits the television to be tilted about horizontal and vertical axes.
    Type: Application
    Filed: October 23, 2003
    Publication date: April 28, 2005
    Inventor: John Rabenius
  • Patent number: 6239973
    Abstract: An electronic cartridge which includes a cover that is electrically coupled to a substrate by a clip. An integrated circuit package is mounted to the substrate and at least partially enclosed by the cover. The clips and cover may be connected to a ground plane of the substrate. The cover and substrate may create a “shield” about the integrated circuit package so that any electromagnetic field that flows from the package is grounded to the substrate.
    Type: Grant
    Filed: March 27, 2000
    Date of Patent: May 29, 2001
    Assignee: Intel Corporation
    Inventors: Scot W. Taylor, Robert Starkston, Charles Gealer, Michael L. Rutigliano, Raymond A. Krick, John A. Rabenius, Edmond L. Hart, Ravi V. Mahajan, Farukh Fares
  • Patent number: 6043983
    Abstract: An electronic cartridge which includes a cover that is electrically coupled to a substrate by a clip. An integrated circuit package is mounted to the substrate and at least partially enclosed by the cover. The clips and cover may be connected to a ground plane of the substrate. The cover and substrate may create a "shield" about the integrated circuit package so that any electro-magnetic field that flows from the package is grounded to the substrate.
    Type: Grant
    Filed: June 17, 1998
    Date of Patent: March 28, 2000
    Assignee: Intel Corporation
    Inventors: Scot W. Taylor, Robert Starkston, Charles Gealer, Michael L. Rutigliano, Raymond A. Krick, John A. Rabenius, Edmond L. Hart, Ravi V. Mahajan, Farukh Fares