Abstract: A socket for receiving a lead of an electronic component comprises a socket body having a tubular body portion and a lead gripping portion. The tubular body portion defines a reception zone for receiving the lead of the electronic component along a lead receiving axis. The lead gripping portion has angularly spaced apart spring fingers which are separated by gaps. The spring fingers extend from the tubular body portion and converge inwardly toward the lead receiving axis to define a constriction for frictionally gripping the lead. Segments of the tubular body portion which are adjacent to and axially aligned with the gaps between the spring fingers are bent outwardly. The outwardly bent segments define retention barbs which are engageable with a wall of the hole in the substrate to retain the socket in the substrate.

Abstract: A solderless spring socket for use in printed circuit boards is disclosed. The socket includes a first section having outwardly biased, resilient retention members for engaging a wall of a plated through hole in the circuit board to retain the socket therein. The socket further includes a second section having inwardly biased spring fingers for compressively engaging a lead from an electronic package inserted thereinto.