Abstract: A solid waste compactor having multiple waste receptacles for separately receiving, temporarily holding, and compacting separate classes of solid waste, for example paper, glass, aluminum cans and steel cans. In one preferred embodiment there is a single screw-driven compaction ram which compacts solid waste in the several receptacles, which are rotatable into position beneath the ram on a revolving table. In an alternative embodiment there are multiple compaction rams for the multiple receptacles, with all the compaction rams being driven in series by means of a common drive chain, and with the receptacles being mounted on a slidable carriage for removal from the compactor.

Abstract: A solid waste compactor having multiple waste receptacles for separately receiving, temporarily holding, and compacting separate classes of solid waste, for example paper, glass, aluminum cans and steel cans. In one preferred embodiment there is a single screw-driven compaction ram which compacts solid waste in the several receptacles, which are rotatable into position beneath the ram on a revolving table. In an alternative embodiment there are multiple compaction rams for the multiple receptacles, with all the compaction rams being driven in series by means of a common drive chain, and with the receptacles being mounted on a slidable carriage for removal from the compactor.

Abstract: A solid waste compactor having multiple waste receptacles for separately receiving, temporarily holding and compacting separate classes of solid waste, for example paper, glass, aluminum cans and steel cans. A single screw-driven compaction ram compacts solid waste in the several receptacles. The compaction ram extends from a trolley which is movable in two orthogonal directions on orthogonal tracks positioned above the receptacles. A reversible compaction motor mounted on the trolley drives the compaction ram up and down. The receptacles are mounted on a slidable carriage for removal from the compactor.

Abstract: An apparatus for establishing a flow of fluid mass, such as gas, having steady uniform flow at a test section area of the closed loop chamber. The chamber provides a constant and reproducible atmosphere in which the rates of electrolytic metal migration and corrosion can be determined as a function of pollutant concentration and humidity content velocity. The overall length to diameter ratio (L/D) of the chamber is reduced in comparison to conventional chambers.

Abstract: The specification discloses a process for forming a superconductor/semiconductor junction structure having optimized low-temperature current transport properties by first providing a substrate of a chosen semiconductor material having an atomically clean surface. A layer of a first chosen superconducting material is deposited on or above the surface of the substrate to a predetermined thickness. Either before or after the formation of this layer of the first superconducting material, a region of a second chosen superconducting material is formed between the surface of the substrate and the layer of the first superconducting material to serve as an interfacial reaction barrier to prevent the reaction between the surface of the substrate and the first chosen superconducting material at the interface thereof which would otherwise result in the formation of an undesired non-superconducting material at the interface.

Abstract: The specification discloses a process for forming a superconductor/semiconductor junction structure having optimized low-temperature current transport properties by first providing a substrate of a chosen semiconductor material having an atomically clean surface. A layer of a first chosen superconducting material is deposited on or above the surface of the substrate to a predetermined thickness. Either before or after the formation of this layer of the first superconducting material, a region of a second chosen superconducting material is formed between the surface of the substrate and the layer of the first superconducting material to serve as an interfacial reaction barrier to prevent the reaction between the surface of the substrate and the first chosen superconducting material at the interface thereof which would otherwise result in the formation of an undesired non-superconducting material at the interface.