Patents by Inventor John A. Vidallon
John A. Vidallon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11554563Abstract: The method regards manufacturing devices by replication, wherein each of the devices comprises a device surface. The method comprises producing the devices from a replication material by replication using a replication tool (1), wherein the replication tool (1) comprises a tool material comprising replication sites (4) comprising a replication surface (5) each. Each of the replication surfaces (5) corresponds to a negative of the device surface of a respective one of the devices. The tool material comprises, in addition to the replication sites, one or more mitigating features (7) for reducing asymmetric form errors of the device surfaces. Replication tools (1) and methods for manufacturing these are also described.Type: GrantFiled: July 17, 2018Date of Patent: January 17, 2023Assignee: Heptagon Micro Optics Pte. Ltd.Inventors: QiChuan Yu, Han Nee Ng, Tobias Senn, John A. Vidallon, Ramon Opeda, Attilio Ferrari, Harmut Rudmann, Martin Schubert
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Patent number: 11422291Abstract: The method for manufacturing a multitude of devices comprises: providing a replication tool comprising a tool material; conditioning the replication tool, wherein the conditioning comprises applying a treatment to the tool material, wherein the treatment comprises exposing the tool material to a conditioning material. And it further comprises, after the conditioning: carrying out one or more replication processes, wherein in each of the one or more replication processes, one or more of the devices are produced from a replication material by replication using the replication tool. The treatment can comprise dimensionally changing the tool material by the exposure of the tool material to the conditioning material. Before carrying out the replication processes, the conditioning material can be hardened and removed.Type: GrantFiled: May 2, 2018Date of Patent: August 23, 2022Assignee: Heptagon Micro Optics Pte. Ltd.Inventors: Qichuan Yu, Han Nee Ng, Tobias Senn, John A. Vidallon, Ramon Opeda, Jr., Attilio Ferrari, Hartmut Rudmann, Martin Schubert
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Publication number: 20200353707Abstract: The method regards manufacturing devices by replication, wherein each of the devices comprises a device surface. The method comprises producing the devices from a replication material by replication using a replication tool (1), wherein the replication tool (1) comprises a tool material comprising replication sites (4) comprising a replication surface (5) each. Each of the replication surfaces (5) corresponds to a negative of the device surface of a respective one of the devices. The tool material comprises, in addition to the replication sites, one or more mitigating features (7) for reducing asymmetric form errors of the device surfaces. Replication tools (1) and methods for manufacturing these are also described.Type: ApplicationFiled: July 17, 2018Publication date: November 12, 2020Inventors: QiChuan Yu, Han Nee Ng, Tobias Senn, John A. Vidallon, Ramon Opeda, Attilio Ferrari, Harmut Rudmann, Martin Schubert
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Publication number: 20200200949Abstract: The method for manufacturing a multitude of devices comprises: providing a replication tool comprising a tool material; conditioning the replication tool, wherein the conditioning comprises applying a treatment to the tool material, wherein the treatment comprises exposing the tool material to a conditioning material. And it further comprises, after the conditioning: carrying out one or more replication processes, wherein in each of the one or more replication processes, one or more of the devices are produced from a replication material by replication using the replication tool. The treatment can comprise dimensionally changing the tool material by the exposure of the tool material to the conditioning material. Before carrying out the replication processes, the conditioning material can be hardened and removed.Type: ApplicationFiled: May 2, 2018Publication date: June 25, 2020Inventors: Qichuan YU, Han Nee NG, Tobias SENN, John A. VIDALLON, Ramon OPEDA, Attilio FERRARI, Hartmut RUDMANN, Martin SCHUBERT
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Patent number: 10199426Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.Type: GrantFiled: December 1, 2017Date of Patent: February 5, 2019Assignee: Heptagon Micro Optics Pte. Ltd.Inventors: Hartmut Rudmann, Simon Gubser, Susanne Westenhöfer, Stephan Heimgartner, Jens Geiger, Sonja Hanselmann, Christoph Friese, Xu Yi, Thng Chong Kim, John A. Vidallon, Ji Wang, Qi Chuan Yu, Kam Wah Leong
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Patent number: 10186540Abstract: Optoelectronic modules include an optoelectronic device and a transparent cover. A non-transparent material is provided on the sidewalls of the transparent cover, which can help reduce light leakage from the sides of the transparent cover or can help reduce stray light from entering the module. The modules can be fabricated, for example, in wafer-level processes. In some implementations, openings such as trenches are formed in a transparent wafer. The trenches then can be filled with a non-transparent material using, for example, a vacuum injection tool. When a wafer-stack including the trench-filled transparent wafer subsequently is separated into individual modules, the result is that each module can include a transparent cover having sidewalls that are covered by the non-transparent material.Type: GrantFiled: June 18, 2015Date of Patent: January 22, 2019Assignee: Heptagon Micro Optics Pte. Ltd.Inventors: Hartmut Rudmann, Simon Gubser, Susanne Westenhöfer, Stephan Heimgartner, Jens Geiger, Xu Yi, Thng Chong Kim, John A. Vidallon, Ji Wang, Qi Chuan Yu, Kam Wah Leong
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Publication number: 20180102394Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.Type: ApplicationFiled: December 1, 2017Publication date: April 12, 2018Applicant: Heptagon Micro Optics Pte. Ltd.Inventors: Hartmut Rudmann, Simon Gubser, Susanne Westenhöfer, Stephan Heimgartner, Jens Geiger, Sonja Hanselmann, Christoph Friese, Xu Yi, Thng Chong Kim, John A. Vidallon, Ji Wang, Qi Chuan Yu, Kam Wah Leong
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Patent number: 9899251Abstract: Techniques are described for holding a wafer or wafer sub-stack to facilitate further processing of the wafer of sub-stack. In some implementations, a wafer or wafer sub-stack is held by a vacuum chuck in a manner that can help reduce bending of the wafer or wafer sub-stack.Type: GrantFiled: September 8, 2017Date of Patent: February 20, 2018Assignee: Heptagon Micro Optics Pte. Ltd.Inventors: Hartmut Rudmann, Stephan Heimgartner, John A. Vidallon
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Publication number: 20180005864Abstract: Techniques are described for holding a wafer or wafer sub-stack to facilitate further processing of the wafer of sub-stack. In some implementations, a wafer or wafer sub-stack is held by a vacuum chuck in a manner that can help reduce bending of the wafer or wafer sub-stack.Type: ApplicationFiled: September 8, 2017Publication date: January 4, 2018Applicant: Heptagon Micro Optics Pte. Ltd.Inventors: Hartmut Rudmann, Stephan Heimgartner, John A. Vidallon
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Patent number: 9859327Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.Type: GrantFiled: December 2, 2016Date of Patent: January 2, 2018Assignee: Heptagon Micro Optics Pte. Ltd.Inventors: Hartmut Rudmann, Simon Gubser, Susanne Westenhöfer, Stephan Heimgartner, Jens Geiger, Sonja Hanselmann, Christoph Friese, Xu Yi, Thng Chong Kim, John A. Vidallon, Ji Wang, Qi Chuan Yu, Kam Wah Leong
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Patent number: 9793152Abstract: Techniques are described for holding a wafer or wafer sub-stack to facilitate further processing of the wafer of sub-stack. In some implementations, a wafer or wafer sub-stack is held by a vacuum chuck in a manner that can help reduce bending of the wafer or wafer sub-stack.Type: GrantFiled: June 28, 2013Date of Patent: October 17, 2017Assignee: Heptagon Micro Optics Pte. Ltd.Inventors: Hartmut Rudmann, Stephan Heimgartner, John A. Vidallon
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Publication number: 20170084663Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.Type: ApplicationFiled: December 2, 2016Publication date: March 23, 2017Applicant: Heptagon Micro Optics Pte. Ltd.Inventors: Hartmut Rudmann, Simon Gubser, Susanne Westenhöfer, Stephan Heimgartner, Jens Geiger, Sonja Hanselmann, Christoph Friese, Xu Yi, Thng Chong Kim, John A. Vidallon, Ji Wang, Qi Chuan Yu, Kam Wah Leong
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Patent number: 9543354Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.Type: GrantFiled: July 24, 2014Date of Patent: January 10, 2017Assignee: Heptagon Micro Optics Pte. Ltd.Inventors: Hartmut Rudmann, Simon Gubser, Susanne Westenhöfer, Stephan Heimgartner, Jens Geiger, Sonja Hanselmann, Christoph Friese, Xu Yi, Thng Chong Kim, John A. Vidallon, Ji Wang, Qi Chuan Yu, Kam Wah Leong
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Publication number: 20150340265Abstract: Techniques are described for holding a wafer or wafer sub-stack to facilitate further processing of the wafer of sub-stack. In some implementations, a wafer or wafer sub-stack is held by a vacuum chuck in a manner that can help reduce bending of the wafer or wafer sub-stack.Type: ApplicationFiled: June 28, 2013Publication date: November 26, 2015Inventors: Hartmut Rudmann, Stephan Heimgartner, John A. Vidallon
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Publication number: 20150325613Abstract: Optoelectronic modules include an optoelectronic device and a transparent cover. A non-transparent material is provided on the sidewalls of the transparent cover, which can help reduce light leakage from the sides of the transparent cover or can help reduce stray light from entering the module. The modules can be fabricated, for example, in wafer-level processes. In some implementations, openings such as trenches are formed in a transparent wafer. The trenches then can be filled with a non-transparent material using, for example, a vacuum injection tool. When a wafer-stack including the trench-filled transparent wafer subsequently is separated into individual modules, the result is that each module can include a transparent cover having sidewalls that are covered by the non-transparent material.Type: ApplicationFiled: June 18, 2015Publication date: November 12, 2015Inventors: Hartmut Rudmann, Simon Gubser, Susanne Westenhöfer, Stephan Heimgartner, Jens Geiger, Xu Yi, Thng Chong Kim, John A. Vidallon, Ji Wang, Qi Chuan Yu, Kam Wah Leong
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Patent number: 9094593Abstract: Optoelectronic modules include an optoelectronic device and a transparent cover. A non-transparent material is provided on the sidewalls of the transparent cover, which can help reduce light leakage from the sides of the transparent cover or can help reduce stray light from entering the module. The modules can be fabricated, for example, in wafer-level processes. In some implementations, openings such as trenches are formed in a transparent wafer. The trenches then can be filled with a non-transparent material using, for example, a vacuum injection tool. When a wafer-stack including the trench-filled transparent wafer subsequently is separated into individual modules, the result is that each module can include a transparent cover having sidewalls that are covered by the non-transparent material.Type: GrantFiled: July 24, 2014Date of Patent: July 28, 2015Assignee: Heptagon Micro Optics Pte. Ltd.Inventors: Hartmut Rudmann, Simon Gubser, Susanne Westenhöfer, Stephan Heimgartner, Jens Geiger, Xu Yi, Thng Chong Kim, John A. Vidallon, Ji Wang, Qi Chuan Yu, Kam Wah Leong
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Publication number: 20150034975Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.Type: ApplicationFiled: July 24, 2014Publication date: February 5, 2015Inventors: Hartmut Rudmann, Simon Gubser, Susanne Westenhöfer, Stephan Heimgartner, Jens Geiger, Sonja Hanselmann, Christoph Friese, Xu Yi, Thng Chong Kim, John A. Vidallon, Ji Wang, Qi Chuan Yu, Kam Wah Leong
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Publication number: 20150036046Abstract: Optoelectronic modules include an optoelectronic device and a transparent cover. A non-transparent material is provided on the sidewalls of the transparent cover, which can help reduce light leakage from the sides of the transparent cover or can help reduce stray light from entering the module. The modules can be fabricated, for example, in wafer-level processes. In some implementations, openings such as trenches are formed in a transparent wafer. The trenches then can be filled with a non-transparent material using, for example, a vacuum injection tool. When a wafer-stack including the trench-filled transparent wafer subsequently is separated into individual modules, the result is that each module can include a transparent cover having sidewalls that are covered by the non-transparent material.Type: ApplicationFiled: July 24, 2014Publication date: February 5, 2015Inventors: Hartmut Rudmann, Simon Gubser, Susanne Westenhöfer, Stephan Heimgartner, Jens Geiger, Xu Yi, Thng Chong Kim, John A. Vidallon, Ji Wang, Qi Chuan Yu, Kam Wah Leong
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Publication number: 20100214050Abstract: A low cost, high performance inductive device for use in, e.g. electronic circuits is disclosed. In one exemplary embodiment, the device includes a two-legged magnetically permeable core optimized for fitting with one or more windings. Preferably, the device is also self-leaded, thereby simplifying its installation and mating to a parent device (e.g., PCB). In another embodiment, one or more low profile magnetically permeable cores are mounted on a surface of the self-leaded magnetically permeable core, preferably with a gap. In yet another embodiment, the aforementioned gap is obviated. In yet another embodiment, spacers are positioned on a surface of the self-leaded magnetically permeable core device to position the low profile magnetically permeable at a predetermined distance from the self-leaded magnetically permeable core. In yet another embodiment, a bead inductor is disclosed comprising a plurality of turns. Methods for manufacturing and utilizing the devices are also disclosed.Type: ApplicationFiled: August 25, 2008Publication date: August 26, 2010Inventors: Gil Opina, JR., John Vidallon, Hoi Yean Lim, James Douglas Lint