Abstract: A memory module is built up from a power distribution assembly in the form of plates forming a capacitor of low inductance and a flexible circuit substrate. The circuit substrate is populated with precisely positioned contact pads for the power, read, write and address lines of memory chips that contact the substrate. Memory chips are fixed to heat spreaders and loaded into a chip holder which positions the chips for contact with the contact pads on the substrate. The substrate contact pads are plated to form dendritic crystals of palladium and the memory chips are provided with solder balls on the contact pads of the memory chip. The solder balls are held in contact with the contact pads by the compressive forces of clamping a heat sink over the heat spreaders for testing, and the assembly may be readily disassembled to replace any defective memory. The compression connection of the chips to the substrate may be relied on or the solder balls may be reflowed to establish permanent solder connections.

Abstract: A tape wound coil is provided, for use in magnetic repulsion punching, that has a plurality of slits therein which allow circulation of coolant therethrough. This coil is made of thin copper foil, or the like that is treated with an epoxy, for electrical insulation between the windings, and then wound around a center post. The face of the coil is machined smooth, whereas a counter bore is machined into the back of the coil such that a portion of the center post and the inner most windings are removed. Radial slits are then machined into the back of the coil, which will allow for the coolant flow. Thus, a coil for use in magnetic repulsion punching is provided which maximizes the capacity for carrying electrical current and increases the winding density exhibited by conventional M-R coils. Further, the coil of the present invention will withstand high repetition mechanical shear forces created as a result of the large amount of electrical current pulsing through the windings.