Patents by Inventor John Acocella
John Acocella has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6504105Abstract: High melting temperature Pb/Sn 95/5 solder balls are connected to copper pads on the bottom of a ceramic chip carrier substrate by low melting temperature eutectic Pb/Sn solder. The connection is made by quick reflow to prevent dissolving Pb into the eutectic solder and raising its melting temperature. Then the module is placed on a fiberglass-epoxy circuit board with the solder balls on eutectic Pb/Sn solder bumps on copper pads of the board. The structure is reflowed to simultaneously melt the solder on both sides of the balls to allow each ball to center between the carrier pad and circuit board pad to form a more symmetric joint. This process results in structure that are more reliable under high temperature cycling.Type: GrantFiled: May 1, 1996Date of Patent: January 7, 2003Assignee: International Business Machines CorporationInventors: John Acocella, Donald Ray Banks, Joseph Angelo Benenati, Thomas Caulfield, Karl Grant Hoebener, David P. Watson, John Saunders Corbin, Jr.
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Patent number: 5675889Abstract: Two substrates are produced each with a planar, mirror-image matrix of metal contacts in a surface wiring layer. The substrates are positioned with the matrices in parallel confrontation which defines pairs of confronting contacts. A metal ball is positioned between each pair of contacts with a respective volume of joining material between the ball and each of the two respective contacts. The volumes of joining material are simultaneously melted to allow surface tension to align the substrates and to accurately center the balls between each respective pairs of contacts in a plane defines by the matrix of balls.Type: GrantFiled: June 7, 1995Date of Patent: October 14, 1997Assignee: International Business Machines CorporationInventors: John Acocella, Donald Ray Banks, Joseph Angelo Benenati, Thomas Caulfield, John Saunders Corbin, Jr., Karl Grant Hoebener, David P. Watson
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Patent number: 5591941Abstract: High melting temperature Pb/Sn 95/5 solder balls are connected to copper pads on the bottom of a ceramic chip carrier substrate by low melting temperature eutectic Pb/Sn solder. The connection is made by quick reflow to prevent dissolving Pb into the eutectic solder and raising its melting temperature. Then the module is placed on a fiberglass-epoxy circuit board with the solder balls on eutectic Pb/Sn solder bumps on copper pads of the board. The structure is reflowed to simultaneously melt the solder on both sides of the balls to allow each ball to center between the carrier pad and circuit board pad to form a more symmetric joint. This process results in structure that are more reliable under high temperature cycling.Type: GrantFiled: October 28, 1993Date of Patent: January 7, 1997Assignee: International Business Machines CorporationInventors: John Acocella, Donald R. Banks, Joseph A. Benenati, Thomas Caulfield, Karl G. Hoebener, David P. Watson, John S. Corbin, Jr.
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Patent number: 5338900Abstract: The present invention relates generally to new structures for decals, and more particularly to electrically conductive decals filled with inorganic insulator material. Various methods and processes that are used to make these electrically conductive decals filled with inorganic dielectric material are disclosed.Type: GrantFiled: December 23, 1992Date of Patent: August 16, 1994Assignee: International Business Machines CorporationInventors: Mark S. Schneider, John Acocella, Lester W. Herron, Mark R. Kordus, Louis H. Wirtz
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Patent number: 5294830Abstract: An integrated circuit thermal conduction module comprises a substrate having a chip-carrying surface and at least one integrated circuit chip on the substrate. A deformable, liquid-impermeable, thermally conductive film or foil extends over an upper surface of the chip. A piston has a lower surface which urges and conforms the film against the chip upper surface and which contains at least one open channel permitting coolant passage and contact with the film for conveying heat from the chip without direct contact between the coolant and chip. Preferably, the piston has a central passageway extending along the longitudinal axis for channeling the coolant through the piston, and has a plurality of channels extending radially outwardly from the central passageway along the lower face for directing coolant beneath the piston.Type: GrantFiled: May 21, 1991Date of Patent: March 15, 1994Assignee: International Business Machines CorporationInventors: Steven P. Young, John Acocella, Albert J. Fahey, Gaetano P. Messina, Seaho Song
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Patent number: 5277725Abstract: The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addressed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.Type: GrantFiled: May 11, 1992Date of Patent: January 11, 1994Assignee: International Business Machines CorporationInventors: John Acocella, Peter A. Agostino, Arnold I. Baise, Richard A. Bates, Ray M. Bryant, Jon A. Casey, David R. Clarke, George Czornyj, Allen J. Dam, Lawrence D. David, Renuka S. Divakaruni, Werner E. Dunkel, Ajay P. Giri, Liang-Choo Hsia, James N. Humenik, Steven M. Kandetzke, Daniel P. Kirby, John U. Knickerbocker, Sarah H. Knickerbocker, Anthony Mastreani, Amy T. Matts, Robert W. Nufer, Charles H. Perry, Srinivasa S. N. Reddy, Salvatore J. Scilla, Mark A. Takacs, Lovell B. Wiggins
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Patent number: 5167913Abstract: A method of forming an adherent layer of metallurgy on a ceramic substrate which includes the steps of obtaining a ceramic material containing a polymeric binder and copper metallurgy patterns within the ceramic body. In one embodiment of the invention, the ceramic body also contains MgO.Thereafter, a surface layer of metallurgy is formed on the surface of the ceramic body. In one embodiment, the surface layer is nickel and in another embodiment, the surface layer is copper or gold.Then, the ceramic body undergoes a sintering cycle which includes the steps of pyrolysis, binder burnoff and, lastly, densification and, in some cases, crystallization. During densification and crystallization, there is a predetermined steam atmosphere which meets the following requirements: a partial pressure of oxygen less than that necessary to satisfy the equilibrium equation 4Cu+O.sub.2 =2Cu.sub.2 O; and a partial pressure of oxygen less than or equal to that necessary to satisfy the equilibrium equation 2Ni+O.sub.Type: GrantFiled: December 23, 1991Date of Patent: December 1, 1992Assignee: International Business Machines CorporationInventors: John Acocella, Philip L. Flaitz, Raj N. Master, Chandrasekhar Narayan, Sarah H. Knickerbocker, Paul H. Palmateer, Sampath Purushothaman, Srinivasa S. N. Reddy
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Patent number: 5139851Abstract: The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addressed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.Type: GrantFiled: March 30, 1990Date of Patent: August 18, 1992Assignee: International Business Machines CorporationInventors: John Acocella, Arnold I. Baise, Richard A. Bates, Jon A. Casey, David R. Clarke, Renuka S. Divakaruni, James N. Humenik, Steven M. Kandetzke, Daniel P. Kirby, John U. Knickerbocker, Sarah H. Knickerbocker, Amy T. Matts, Robert W. Nufer, Srinivasa S. N. Reddy, Mark A. Takacs, Lovell B. Wiggins
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Patent number: 5135595Abstract: The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addresssed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.Type: GrantFiled: March 30, 1990Date of Patent: August 4, 1992Assignee: International Business Machines CorporationInventors: John Acocella, Peter A. Agostino, Arnold I. Baise, Richard A. Bates, Ray M. Bryant, Jon A. Casey, David R. Clarke, George Czornyj, Allen J. Dam, Lawrence D. David, Renuka S. Divakaruni, Werner E. Dunkel, Ajay P. Giri, Liang-Choo Hsia, James N. Humenik, Steven M. Kandetzke, Daniel P. Kirby, John U. Knickerbocker, Sarah H. Knickerbocker, Anthony Mastreani, Amy T. Matts, Robert W. Nufer, Charles H. Perry, Srinivasa S. N. Reddy, Salvatore J. Scilla, Mark A. Takacs, Lovell B. Wiggins
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Patent number: 5108541Abstract: The present invention relates generally to new processes for making decals, and more particularly to electrically conductive decals filled with inorganic insulator material. Various methods and processes that are used to make these electrically conductive decals filled with inorganic dielectric material are disclosed.Type: GrantFiled: March 6, 1991Date of Patent: April 28, 1992Assignee: International Business Machines Corp.Inventors: Mark S. Schneider, John Acocella, Lester W. Herron, Mark R. Kordus, Louis H. Wirtz
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Patent number: 5031029Abstract: A device that contains a copper substrate; a rigidizing layer and/or a metal layer, and a non-graphitic hard carbon layer deposited on the rigidizing layer; and use as a heat sink or piston for electronic components.Type: GrantFiled: April 4, 1990Date of Patent: July 9, 1991Assignee: International Business Machines CorporationInventors: John Acocella, Nanik Bakhru, Alfred Grill, Egidio Marotta, Bernard S. Meyerson, Vishnubhai V. Patel
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Patent number: 4879156Abstract: A multilayered ceramic (MLC) substrate having embedded and exposed conductors suitable for mounting and interconnecting a plurality of electronic devices exterior thereof. The horizontal planar conductors comprise substantially a plurality of solid, non-porous, homogeneous metal patterns, whereas the vertical interplanar connection conductors are substantially porous metal conductors that are formed by methods such as screening. The process to form the MLC substrate involves forming a pattern of solid, nonporous conductors to a backing sheet having a release layer, then transferring the pattern to a ceramic green sheet. Zero X-Y shrinkage sintering processes allow the MLC substrate and solid metal conductors to be densified without distortion of the solid metal patterns or the ceramic.Type: GrantFiled: March 14, 1988Date of Patent: November 7, 1989Assignee: International Business Machines CorporationInventors: Lester W. Herron, Robert O. Lussow, Robert W. Nufer, Bernard Schwartz, John Acocella, Srinivasa N. Reddy
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Patent number: 4753694Abstract: A multilayered ceramic (MLC) substrate having embedded and exposed conductors suitable for mounting and interconnecting a plurality of electronic devices exterior thereof. The horizontal planar conductors comprise substantially a plurality of solid, non-porous, homogeneous metal patterns, whereas the vertical interplanar connection conductors are substantially porous metal conductors that are formed by methods such as screening. The process to form the MLC substrate involves forming a pattern of solid, nonporous conductors to a backing sheet having a release layer, then transferring the pattern to a ceramic green sheet. Zero X-Y shrinkage sintering processes allow the MLC substrate and solid metal conductors to be densified without distortion of the solid metal patterns or the ceramic.Type: GrantFiled: May 2, 1986Date of Patent: June 28, 1988Assignee: International Business Machines CorporationInventors: Lester W. Herron, Robert O. Lussow, Robert W. Nufer, Bernard Schwartz, John Acocella, Srinivasa N. Reddy
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Patent number: 4747907Abstract: A metal etching process involving an oxidation-reduction reaction where the metal being etched is oxidized and the active ingredient in the etchant solution is reduced, incorporates contacting said metal with an etching solution containing an active ingredient selected from the group consisting of ferric ions, ferricyanide ions, ceric ions, chromate ions, dichromate ions, and iodine, and introducing ozone into said etching solution to rejuvenate and agitate the solution.Type: GrantFiled: October 29, 1986Date of Patent: May 31, 1988Assignee: International Business Machines CorporationInventors: John Acocella, Lawrence D. David
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Patent number: 4620863Abstract: A radiation coloration resistant glass is disclosed which is used in a radiation environment sufficient to cause coloration in most forms of glass. The coloration resistant glass includes higher proportions by weight of water and has been found to be extremely resistant to color change when exposed to such radiation levels. The coloration resistant glass is free of cerium oxide and has more than about 0.5% by weight water content. Even when exposed to gamma radiation of more than 10.sup.7 rad, the coloration resistant glass does not lose transparency.Type: GrantFiled: October 14, 1983Date of Patent: November 4, 1986Assignee: Rensselaer Polytechnic InstituteInventors: Minoru Tomozawa, E. Bruce Watson, John Acocella