Patents by Inventor John Adam Tracy deMercleden Smithells

John Adam Tracy deMercleden Smithells has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for Forming Flipped-Conductor-Patch
    Publication number: 20220361329
    Abstract: A method includes providing a layer of non-conductive material having a conductive electroplating seed layer formed on a surface thereof; applying a photoresist layer over the surface of the conductive electroplating seed layer; and defining wiring channels in the photoresist resist layer. The method includes electroplating a conductive material in the defined wiring channels; adhering a non-conductive layer over the photoresist layer and the plated conductive material in the wiring channels; and removing the layer of non-conductive material and the conductive electroplating seed layer.
    Type: Application
    Filed: July 19, 2022
    Publication date: November 10, 2022
    Applicant: Microchip Technology Caldicot Limited
    Inventors: John Adam Tracy deMercleden Smithells, Nina Biddle
  • Flipped-conductor-patch lamination for ultra fine-line substrate creation
    Patent number: 11432402
    Abstract: A lamination circuit board structure lamination circuit board structure includes a printed circuit board substrate including conductive wiring traces on at least a first wiring face, a prepreg layer formed over the first wiring face, and a patch having an area smaller than 1,000 mm2. The patch includes conductive wiring traces formed on a wiring face and is laminated to the printed circuit board substrate over the prepreg layer, oriented with the wiring face in contact with and pressed into the prepreg layer. Portions of the prepreg layer fill interstices between the conductive wiring traces.
    Type: Grant
    Filed: November 12, 2018
    Date of Patent: August 30, 2022
    Assignee: Microchip Technology Caldicot Limited
    Inventors: John Adam Tracy deMercleden Smithells, Nina Biddle
  • Flipped-Conductor-Patch Lamination for Ultra Fine-Line Substrate Creation
    Publication number: 20210092842
    Abstract: A lamination circuit board structure lamination circuit board structure includes a printed circuit board substrate including conductive wiring traces on at least a first wiring face, a prepreg layer formed over the first wiring face, and a patch having an area smaller than 1,000 mm2. The patch includes conductive wiring traces formed on a wiring face and is laminated to the printed circuit board substrate over the prepreg layer, oriented with the wiring face in contact with and pressed into the prepreg layer.
    Type: Application
    Filed: November 12, 2018
    Publication date: March 25, 2021
    Applicant: Microsemi Semiconductor Limited
    Inventors: John Adam Tracy deMercleden Smithells, Nina Biddle
  • Flipped-Conductor-Patch Lamination for Ultra Fine-Line Substrate Creation
    Publication number: 20200120797
    Abstract: A lamination circuit board structure lamination circuit board structure includes a printed circuit board substrate including conductive wiring traces on at least a first wiring face, a prepreg layer formed over the first wiring face, and a patch having an area smaller than 1,000 mm2. The patch includes conductive wiring traces formed on a wiring face and is laminated to the printed circuit board substrate over the prepreg layer, oriented with the wiring face in contact with and pressed into the prepreg layer.
    Type: Application
    Filed: November 12, 2018
    Publication date: April 16, 2020
    Applicant: Microsemi Semiconductor Limited
    Inventors: John Adam Tracy deMercleden Smithells, Nina Biddle