Abstract: It is desirable to improve a longevity and reliability of a substrate used within an IC package. By modifying a design of the one or more layout masks used to create planes within a substrate, the resulting planes may have a non-straight pattern on the edges of each plane and may include a predetermined pattern of open spaces filled with dielectric materials in each plane. The improved mechanical strength of the patterned planes can effectively compensate the effect of mismatched thermal expansion during IC testing and deployment, resulting in increased durability and longevity of the package substrates.

Abstract: A method for removing a die from a plastic package. The first step of the method is to remove the package's cap. Next, the package and the die within it are placed on a hot plate and heated up. When the plastic package's temperature reaches a certain limit, the plastic package cracks, resulting in at least one fracture in the package. Each side of the cracked plastic package along the fracture is then grasped by a pair of pliers and the two pairs of pliers are pulled in opposite directions. As a result, the die is detached from the plastic package.