Abstract: A computer system for a motion impaired user includes a housing, a processor in the housing, and a display connected to the processor for displaying at least one menu of selectable commands arranged in a sequence. A mouse is connected to the processor for positioning a pointer on the display responsive to movement of the mouse. The computer further includes a mouse template having at least one elongate body having a plurality of stations therealong corresponding to the sequence of selectable commands and cooperates with the mouse for assisting the motion impaired user so that when the mouse is positioned at a station, the pointer on the display is positioned at the corresponding selectable command of the menu.

Abstract: A connector and associated method for interconnecting a plurality of adjacent paired wire terminations on a standard 110 style punch down wiring block for a telephone system. The connector includes two isolated conductors disposed along the length of the connector body and a plurality of pins connected to the respective conductors and extending away from the body. The pins are adapted for insertion into respective 110 style punch down block terminations when the connector is installed in a connected position on the wiring block, thereby connecting in parallel a plurality of telephones hard-wired to the adjacent paired wire terminations. The connector may be formed to have one or more break points disposed between respective pairs of the pins for easy breaking/cutting of the connector to a desired length for interconnecting a predetermined number of telephones.

Abstract: A method and apparatus for controlling a pointer on a computer screen adapted for use by individuals with limited or no manual dexterity. A track ball is positioned to protrude from the upper surface of a generally partially cylindrically shaped base. A mating cradle sits on top of the base with its lower surface in contact with the upper surface of the track ball and the upper surface of the base. The upper surface of the cradle support is shaped to accept the forearm of an operator. The track ball is coupled in a known fashion to operate a pointer on a computer display. The operator can move the cursor up and down on the screen by pushing his or her arm outwardly or inwardly and can move the cursor left to right on the screen by rotating his or her arm in the cradle about its longitudinal axis.

Abstract: An apparatus for determining endpoint in the chemical mechanical polishing of a metal film using an acidic slurry includes a hydrogen sensor which senses the amount of hydrogen vapor being produced as a result of the reaction between the metal film and the acidic slurry. When the concentration of hydrogen vapor in the reaction area drops, endpoint is attained and the polishing operation may be terminated or otherwise adjusted. Hydrogen sensing elements include a palladium gate MOS transistor, expandable plastics and a tungsten oxide film.

Abstract: A method and apparatus for making a chemical mechanical polishing (CMP) article dissolves gas into solidifiable material, and reduces pressure on the solidifiable material to form gas bubbles therein while solidifying the solidifiable material to make a matrix with voids therein. The gas bubbles are preferably formed to define voids interconnected with adjacent voids to thereby define a porous matrix. The porous matrix ensures uniform distribution of the CMP slurry for greater polishing uniformity. The method produces a CMP pad, for example, with very uniform porosity throughout its thickness so that polishing remains uniform as the pad is consumed in use. The gas and the solidifiable material may preferably be non-reactive with one another. The gas may comprise at least one inert gas, such as nitrogen or argon, for example. The solidifiable material may be a polymer-forming liquid and at least one of a curing and cross-linking agent mixed therein.

Abstract: A method for preparing a chemical mechanical polishing apparatus for polishing product substrates includes polishing designated “warm-up” substrates until polishing pad characteristics have achieved steady state conditions. The reusable warm-up substrates may be formed of a mechanically resistant material or a material having substantially the same removal characteristic as the product film to be polished. The reusable warm-up substrates may also be formed of a mechanically resistant film formed over a semiconductor substrate. The polishing pad characteristic of pad compression may be determined using a previously established correlation or it may be measured.

Abstract: An apparatus and method for conditioning a polishing pad used in a chemical mechanical polishing (CMP) process. The polishing pad is conditioned by the application of a conditioning device to the surface of the rotating polishing pad. The amount of force which is applied to the conditioning device is directly controlled by a force control mechanism so as to make the conditioning process more consistent.

Abstract: A method for removing microorganism contamination from a polishing slurry used for chemical mechanical polishing operations in the semiconductor manufacturing industry includes treating a slurry stream with ultraviolet (uv) energy to destroy the microorganisms, then filtering the uv-treated stream to remove the destroyed microorganisms before the slurry is delivered to the polishing apparatus.