Patents by Inventor John Ambrus

John Ambrus has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Topless semiconductor package
    Patent number: 7034385
    Abstract: A semiconductor package which includes a die pad that is exposed through the top surface of its molded housing, a semiconductor die having one power electrode electrically and mechanically connected to the underside of the die pad, and another power electrode electrically connected to a lead.
    Type: Grant
    Filed: August 5, 2004
    Date of Patent: April 25, 2006
    Assignee: International Rectifier Corporation
    Inventor: John Ambrus
  • Topless semiconductor package
    Publication number: 20050029634
    Abstract: A semiconductor package which includes a die pad that is exposed through the top surface of its molded housing.
    Type: Application
    Filed: August 5, 2004
    Publication date: February 10, 2005
    Inventor: John Ambrus