Abstract: This invention is directed to a precursor for preparing a resist pattern by heat mode imaging, the precursor comprising a heat sensitive composition, the solubility of which in an aqueous alkaline developer is arranged to increase in heated areas, and a means for increasing the resistance of non-heated areas of the heat sensitive composition to dissolution in an aqueous alkaline developer (the “developer resistance means”), wherein said developer resistance means comprises one or more compounds selected from the group consisting of: (A) compounds which include a poly(alkylene oxide) unit; (B) siloxanes; and (C) esters, ethers and amides of polyhydric alcohols, wherein said heat-sensitive composition comprises an aqueous alkaline developer soluble polymeric substance (i.e. the “active polymer”) and a compound which reduces the aqueous alkaline developer solubility of the polymeric substance (i.e.