Patents by Inventor John Andrew Lebens

John Andrew Lebens has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9591752
    Abstract: Conductive articles and devices have conductive micro-wires formed by curing a photocurable layer on a transparent flexible substrate that has a distortion temperature of less than 150° C. The photocurable layer has a viscosity <5,000 Pascal-seconds at the temperature micro-channels formation and the micro-channels having an average width of less than or equal to 4 ?m and an average depth to average width ratio that is greater than or equal to 1. The photocurable layer is exposed to curing ultraviolet radiation to form a pattern of photocured micro-channels and a conductive composition comprising metal nano-particles is formed in the photocured micro-channels. The conductive composition is cured in the pattern of photocured micro-channels to provide a pattern of conductive micro-wires in the pattern of photocured micro-channels on the transparent flexible substrate. Each of at least 50% of the conductive micro-wires has a sheet resistance of less than 0.025 ohms/sq.
    Type: Grant
    Filed: August 26, 2015
    Date of Patent: March 7, 2017
    Assignee: EASTMAN KODAK COMPANY
    Inventors: Yongcai Wang, John Andrew Lebens, Mitchell Lawrence Wright, Julie A. Cummings
  • Patent number: 9506891
    Abstract: A method of making an imprinted electronic sensor structure on a substrate for sensing an environmental factor includes coating, imprinting, and curing a curable layer on the substrate to form a plurality of spatially separated micro-channels extending from the layer surface into the cured layer. First and second layers are located in each micro-channel to form a multi-layer micro-wire. Either the first layer is a cured electrical conductor forming a conductive layer located only within the micro-channel and the second layer is a reactive layer or the first layer is a reactive layer and the second layer is a cured electrical conductor forming a conductive layer located only within the micro-channel. The reactive layer is exposed to the environmental factor and at least a portion of the reactive layer responds to the environmental factor.
    Type: Grant
    Filed: August 15, 2014
    Date of Patent: November 29, 2016
    Assignee: EASTMAN KODAK COMPANY
    Inventors: John Andrew Lebens, Ronald Steven Cok, Yongcai Wang
  • Publication number: 20160303844
    Abstract: A method of making an imprinted double-sided structure includes providing a substrate having first and second opposing sides, first and second imprinting stamps each having an imprinting side and a support side with first and second portions, and first and second rollers. A curable layer is formed on each side of the substrate. The imprinting side of each stamp is located facing the corresponding substrate side and each roller is located facing the corresponding first portion of the support side of each imprinting stamp. Simultaneously, the rollers are pressed against the respective first portions and rolled along the respective support surfaces of the first and second stamps from the first portion to the second portion. The first and second curable layers are simultaneously cured to form cured imprinted layers on both sides of the substrate. The first and second stamps are removed.
    Type: Application
    Filed: April 15, 2015
    Publication date: October 20, 2016
    Inventors: John Andrew Lebens, Yongcai Wang, Ronald Steven Cok, Mitchell Lawrence Wright
  • Publication number: 20160122559
    Abstract: An imprinted multi-layer structure includes a support and a structured bi-layer on or over the support, The structured bi-layer includes a first cured layer having a first cross-linked material on or over the support. A second cured layer has a second material different from the first material on or over the first cured layer on a side of the first cured layer opposite the support. The structured bi-layer has at least a depth greater than the thickness of the second cured layer. The first material is cross-linked to the second material.
    Type: Application
    Filed: October 29, 2014
    Publication date: May 5, 2016
    Inventors: Yongcai Wang, John Andrew Lebens, Ronald Steven Cok
  • Patent number: 9328253
    Abstract: A method of making a conductive article includes providing a substrate having a surface with one or more micro-channels having a width of less than 12 ?m. A composition is provided over the substrate and in the one or more micro-channels. The composition includes water and silver nanoparticles dispersed in the water and he weight percentage of silver in the composition is greater than 70% and the viscosity of the composition is in a range from 10 to 10,000 centipoise. The composition is removed from the surface of the substrate. The composition provided in the micro-channels is dried and converted to form one or more electrically conductive micro-wires.
    Type: Grant
    Filed: February 4, 2013
    Date of Patent: May 3, 2016
    Assignee: EASTMAN KODAK COMPANY
    Inventors: Yongcai Wang, Paul Matthew Hoderlein, John Andrew Lebens, Hwei-Ling Yau, David Paul Trauernicht
  • Patent number: 9282647
    Abstract: A method of making a micro-channel structure and applying a curable ink to the micro-channel structure includes providing a substrate and depositing a single layer of a curable polymer on the substrate, the single curable layer having a layer thickness. One or more micro-channels adapted to receive curable ink are embossed into the single curable layer, the micro-channels having a micro-channel thickness that is in a range of two microns to ten microns less than the layer thickness. The single curable layer is cured to form a single cured layer so that deformations of the micro-channels or the surface of the single cured layer are reduced. Curable ink is coated over the surface and micro-channels of the single cured layer. The curable ink is removed from the surface of the single cured layer and the curable ink is cured.
    Type: Grant
    Filed: January 22, 2013
    Date of Patent: March 8, 2016
    Assignee: EASTMAN KODAK COMPANY
    Inventors: David Paul Trauernicht, John Andrew Lebens, Yongcai Wang
  • Publication number: 20160047766
    Abstract: An imprinted electronic sensor structure on a substrate for sensing an environmental factor includes a cured layer having a layer surface located on the substrate. Spatially separated micro-channels extend from the layer surface into the cured layer. A multi-layer micro-wire is formed in each micro-channel. Each multi-layer micro-wire includes at least a conductive layer and a reactive layer. The reactive layer is exposed to the environmental factor. The conductive layer is a cured electrical conductor located only within the micro-channel and at least a portion of the reactive layer responds to the environmental factor.
    Type: Application
    Filed: August 15, 2014
    Publication date: February 18, 2016
    Inventors: John Andrew Lebens, Ronald Steven Cok, Yongcai Wang
  • Publication number: 20160047767
    Abstract: A method of operating an imprinted electronic sensor to sense an environmental factor includes providing spatially separated micro-channels in a cured layer on a substrate. A multi-layer micro-wire is formed in each micro-channel. Each multi-layer micro-wire includes at least a conductive layer and a reactive layer exposed to the environmental factor. The conductive layer is a cured electrical conductor located only within the micro-channel and at least a portion of the reactive layer responds to the environmental factor. A controller is provided for electrically controlling first and second groups of multi-layer micro-wires, each first and second group including one or more multi-layer micro-wires. The reactive layer is exposed to the environment. The controller measures the electrical response of the first and second groups of multi-layer micro-wires.
    Type: Application
    Filed: August 15, 2014
    Publication date: February 18, 2016
    Inventors: John Andrew Lebens, Ronald Steven Cok, Yongcal Wang
  • Publication number: 20160047772
    Abstract: A method of making an imprinted electronic sensor structure on a substrate for sensing an environmental factor includes coating, imprinting, and curing a curable layer on the substrate to form a plurality of spatially separated micro-channels extending from the layer surface into the cured layer. First and second layers are located in each micro-channel to form a multi-layer micro-wire. Either the first layer is a cured electrical conductor forming a conductive layer located only within the micro-channel and the second layer is a reactive layer or the first layer is a reactive layer and the second layer is a cured electrical conductor forming a conductive layer located only within the micro-channel. The reactive layer is exposed to the environmental factor and at least a portion of the reactive layer responds to the environmental factor.
    Type: Application
    Filed: August 15, 2014
    Publication date: February 18, 2016
    Inventors: John Andrew Lebens, Ronald Steven Cok, Yongcai Wang
  • Patent number: 9226411
    Abstract: A method of making a multi-layer micro-wire structure includes providing a substrate having a surface and forming a plurality of micro-channels in the surface. A first material composition is located in a first layer only in each micro-channel and not on the surface. A second material composition different from the first material composition is located in a second layer different from the first layer only in each micro-channel and not on the surface. The first material composition in the first layer and the second material composition in the second layer form an electrically conductive multi-layer micro-wire in each micro-channel.
    Type: Grant
    Filed: July 9, 2014
    Date of Patent: December 29, 2015
    Assignee: EASTMAN KODAK COMPANY
    Inventors: Hwei-Ling Yau, David Paul Trauernicht, John Andrew Lebens, Yongcai Wang, Ronald Steven Cok
  • Publication number: 20150366057
    Abstract: Conductive articles and devices have conductive micro-wires formed by curing a photocurable layer on a transparent flexible substrate that has a distortion temperature of less than 150° C. The photocurable layer has a viscosity <5,000 Pascal-seconds at the temperature micro-channels formation and the micro-channels having an average width of less than or equal to 4 ?m and an average depth to average width ratio that is greater than or equal to 1. The photocurable layer is exposed to curing ultraviolet radiation to form a pattern of photocured micro-channels and a conductive composition comprising metal nano-particles is formed in the photocured micro-channels. The conductive composition is cured in the pattern of photocured micro-channels to provide a pattern of conductive micro-wires in the pattern of photocured micro-channels on the transparent flexible substrate. Each of at least 50% of the conductive micro-wires has a sheet resistance of less than 0.025 ohms/sq.
    Type: Application
    Filed: August 26, 2015
    Publication date: December 17, 2015
    Inventors: Yongcai Wang, John Andrew Lebens, Mitchell Lawrence Wright, Julie A. Cummings
  • Patent number: 9186698
    Abstract: A method of making an imprinted multi-layer structure includes providing a support and locating a first curable layer including a first material on or over the support. A second curable layer including a second material different from the first material is located on or over the first curable layer. The first curable layer and the second curable layer are imprinted in a single step with an imprinting stamp having a structure with a depth greater than the thickness of the second curable layer. The first curable layer and the second curable layer are cured in a single step to form a first cured layer and a second cured layer. The imprinting stamp is removed to form an imprinted multi-layer structure with a depth greater than the thickness of the second cured layer.
    Type: Grant
    Filed: October 29, 2014
    Date of Patent: November 17, 2015
    Assignee: EASTMAN KODAK COMPANY
    Inventors: Yongcai Wang, John Andrew Lebens, Ronald Steven Cok
  • Patent number: 9167688
    Abstract: Micro-wires are arranged to form an electrical conductor connected to an electrode structure. The electrical conductor includes a plurality of spaced-apart first micro-wires extending in a first direction, wherein one of the first micro-wires is a connection micro-wire. A plurality of spaced-apart second micro-wires extends in a second direction different from the first direction. At least two adjacent second micro-wires are spaced apart by a distance greater than the spacing between at least two adjacent first micro-wires. Each second micro-wire is electrically connected to at least two first micro-wires. The electrode structure includes a plurality of electrically connected third micro-wires electrically connected to the connection micro-wire at spaced-apart connection locations and at least some of the adjacent connection locations are separated by a distance greater than any of the distances separating the second micro-wires.
    Type: Grant
    Filed: January 28, 2013
    Date of Patent: October 20, 2015
    Assignee: EASTMAN KODAK COMPANY
    Inventors: John Andrew Lebens, David Paul Trauernicht, Yongcai Wang, Ronald Steven Cok
  • Patent number: 9155201
    Abstract: Conductive articles and devices have conductive micro-wires formed by curing a photocurable layer on a transparent flexible substrate that has a distortion temperature of less than 150° C. The photocurable layer has a viscosity <5,000 Pascal-seconds at the temperature micro-channels formation and the micro-channels having an average width of less than or equal to 4 ?m and an average depth to average width ratio that is greater than or equal to 1. The photocurable layer is exposed to curing ultraviolet radiation to form a pattern of photocured micro-channels and a conductive composition comprising metal nano-particles is formed in the photocured micro-channels. The conductive composition is cured in the pattern of photocured micro-channels to provide a pattern of conductive micro-wires in the pattern of photocured micro-channels on the transparent flexible substrate. Each of at least 50% of the conductive micro-wires has a sheet resistance of less than 0.025 ohms/sq.
    Type: Grant
    Filed: December 3, 2013
    Date of Patent: October 6, 2015
    Assignee: EASTMAN KODAK COMPANY
    Inventors: Yongcai Wang, John Andrew Lebens, Mitchell Lawrence Wright, Julie A. Cummings
  • Publication number: 20150279688
    Abstract: A method of making a high-aspect-ratio imprinted structure includes providing a substrate, forming a first layer on the substrate, imprinting a plurality of micro-channels in the first layer, and curing the first layer. Each micro-channel has a bottom and walls, the micro-channel bottom having distinct first and second portions. A material is deposited on the first layer and in each micro-channel and anisotropically etched to remove the deposited material from the first layer and the second portion of the micro-channel bottom, leaving the deposited material on the micro-channel walls. A filler material is located in the micro-channels between the deposited materials and on only the second portion of the micro-channel bottom and cured.
    Type: Application
    Filed: March 31, 2014
    Publication date: October 1, 2015
    Inventors: Ronald Steven Cok, John Andrew Lebens
  • Patent number: 9137893
    Abstract: An electrical conductor includes a substrate having micro-channels formed in the substrate. A plurality of spaced-apart first micro-wires is located on or in the micro-channels, the first micro-wires extending across the substrate in a first direction. A plurality of spaced-apart second micro-wires is located on or in the micro-channels, the second micro-wires extending across the substrate in a second direction different from the first direction. Each second micro-wire is electrically connected to at least two first micro-wires and at least one of the second micro-wires has a width less than the width of at least one of the first micro-wires.
    Type: Grant
    Filed: January 28, 2013
    Date of Patent: September 15, 2015
    Assignee: Eastman Kodak Company
    Inventors: John Andrew Lebens, David Paul Trauernicht, Yongcai Wang, Ronald Steven Cok
  • Patent number: 9131606
    Abstract: A pattern of micro-wires in a layer over which ink is to be coated to form micro-wires includes a substrate with first, second, and third regions. A plurality of connected first micro-channels, second micro-channels, and third micro-channels are formed in the first, second, and third regions having first, second, and third micro-channel densities, respectively. The first density is greater than the second density and the second density is greater than the third density. Thus, the density of the layer monotonically decreases from the first region to the second region and from the second region to the third region so that the ink coated over the layer is more effectively distributed.
    Type: Grant
    Filed: August 12, 2013
    Date of Patent: September 8, 2015
    Assignee: EASTMAN KODAK COMPANY
    Inventors: John Andrew Lebens, Ronald Steven Cok
  • Patent number: 9099227
    Abstract: A pattern of conductive micro-wires as in a conductive pattern can be prepared using photo-lithography, or imprint technology. A photocurable composition is cured to form a pattern of photocured micro-channels. A conductive composition comprising metal nano-particles is added to the photocured micro-channels and excess conductive composition outside the photocured micro-channels is removed. The conductive composition in the photocured micro-channels is then dried at a temperature of less than 60° C. The dried conductive composition in the photocured micro-channels is treated with hydrogen chloride vapor to form conductive micro-wires in the photocured micro-channels at a temperature of less than 60° C. The outer surface of the conductive micro-wires is then polished in the presence of water, to form a micro-wire pattern.
    Type: Grant
    Filed: September 4, 2013
    Date of Patent: August 4, 2015
    Assignee: EASTMAN KODAK COMPANY
    Inventors: Yongcai Wang, John Andrew Lebens, Mitchell Lawrence Wright
  • Patent number: 9085699
    Abstract: A metal nanoparticle composition includes water and a water-soluble polymer having both carboxylic acid and sulfonic acid groups. Silver nanoparticles are dispersed in the water such that the weight percentage of silver in the composition is greater than 10%.
    Type: Grant
    Filed: February 4, 2013
    Date of Patent: July 21, 2015
    Assignee: EASTMAN KODAK COMPANY
    Inventors: Yongcai Wang, Paul Matthew Hoderlein, John Andrew Lebens, Hwei-Ling Yau, David Paul Trauernicht
  • Publication number: 20150156886
    Abstract: Conductive articles and devices have conductive micro-wires formed by curing a photocurable layer on a transparent flexible substrate that has a distortion temperature of less than 150° C. The photocurable layer has a viscosity <5,000 Pascal-seconds at the temperature micro-channels formation and the micro-channels having an average width of less than or equal to 4 ?m and an average depth to average width ratio that is greater than or equal to 1. The photocurable layer is exposed to curing ultraviolet radiation to form a pattern of photocured micro-channels and a conductive composition comprising metal nano-particles is formed in the photocured micro-channels. The conductive composition is cured in the pattern of photocured micro-channels to provide a pattern of conductive micro-wires in the pattern of photocured micro-channels on the transparent flexible substrate. Each of at least 50% of the conductive micro-wires has a sheet resistance of less than 0.025 ohms/sq.
    Type: Application
    Filed: December 3, 2013
    Publication date: June 4, 2015
    Inventors: Yongcai Wang, John Andrew Lebens, Mitchell Lawrence Wright, Julie A. Cummings