Abstract: A gas detecting apparatus and method for detecting gas leaks are disclosed. The gas detecting apparatus includes an infrared (IR) detector configured to monitor a presence of one or more gases in a field-of-interest (FOI), wherein the IR detector generates IR light distribution information within the FOI; a controller configured to analyze the IR light distribution information to identify one or more locations of one or more gases in the FOI; and a visible light projector configured to project a visible image in the FOI based on the analysis by the controller, wherein the visible image depicts the one or more locations of the one or more gases in the FOI.

Abstract: A gas detecting apparatus and a method for detecting gas leaks are disclosed. The gas detecting apparatus includes an infrared (IR) detector configured to monitor a presence of one or more gases in a field-of-interest (FOI), wherein the IR detector generates IR light distribution information within the FOI to be analyzed to identify the presence of one or more gases for a gas leak detection; and a visible light projector configured to project a visible frame image that frames an outer edge of the FOI during the gas leak detection. The method for detecting gas leaks includes generating an infrared (IR) light distribution information within a field-of-interest (FOI) to be analyzed to identify the presence of one or more gases for a gas leak detection; and projecting with a visible light a visible frame image that frames an outer edge of the FOI during the gas leak detection.

Abstract: A gas detecting apparatus and method for detecting gas leaks are disclosed. The gas detecting apparatus includes an infrared (IR) detector configured to monitor a presence of one or more gases in a field-of-interest (FOI), wherein the IR detector generates IR light distribution information within the FOI; a controller configured to analyze the IR light distribution information to identify one or more locations of one or more gases in the FOI; and a visible light projector configured to project a visible image in the FOI based on the analysis by the controller, wherein the visible image depicts the one or more locations of the one or more gases in the FOI.

Abstract: A gas detecting apparatus and a method for detecting gas leaks are disclosed. The gas detecting apparatus includes an infrared (IR) detector configured to monitor a presence of one or more gases in a field-of-interest (FOI), wherein the IR detector generates IR light distribution information within the FOI to be analyzed to identify the presence of one or more gases for a gas leak detection; and a visible light projector configured to project a visible frame image that frames an outer edge of the FOI during the gas leak detection. The method for detecting gas leaks includes generating an infrared (IR) light distribution information within a field-of-interest (FOI) to be analyzed to identify the presence of one or more gases for a gas leak detection; and projecting with a visible light a visible frame image that frames an outer edge of the FOI during the gas leak detection.

Abstract: A multi use circuit module has a front half module. The front half module is a functional circuit module having electrical contacts on a front portion there of for electrically coupling the multi use circuit module to a host device. A rear half module is removably coupled to the front half module. The rear half module increases functionality of the multi use circuit module by allowing functional and non functional components to be coupled to the front half module.

Abstract: A transceiver package includes a substrate having an upper surface. An electronic component is mounted to the upper surface of the substrate. A shield encloses the electronic component and shields the electronic component from radiation. The transceiver package further includes an antenna and a dielectric cap. The dielectric cap is interposed between the shield and the antenna, the shield being a ground plane for the antenna.

Abstract: A lead-frame method and assembly for interconnecting circuits within a circuit module allows a circuit module to be fabricated without a circuit board substrate. Integrated circuit dies are attached to a metal lead-frame assembly and the die interconnects are wire-bonded to interconnect points on the lead-frame assembly. An extension of the lead-frame assembly out of the circuit interconnect plane provides external electrical contacts for connection of the circuit module to a socket.

Abstract: An injection molded lens-barrel assembly and method for fabricating lens-barrel and mount assemblies provides a low cost precision optical front end for digital cameras. A barrel is injection-molded around a lens, securing the lens in place. Alternatively, the lens-barrel assembly may be injection molded in one molding stage having two steps. A transparent material is injected to form a lens and an opaque compatible material is injected to form the barrel, yielding a single part that may be mounted to a digital camera. Multiple lens assemblies may be produced by incorporating an alignment feature on each lens to hold the lenses in an external mold fixture. One or more supporting structures are then molded around the multiple lenses, securing them in mechanical alignment.

Abstract: A transceiver package includes a substrate having an upper surface. An electronic component is mounted to the upper surface of the substrate. A shield encloses the electronic component and shields the electronic component from radiation. The transceiver package further includes an antenna and a dielectric cap. The dielectric cap is interposed between the shield and the antenna, the shield being a ground plane for the antenna.

Abstract: A personalized circuit module package and method for packaging circuit modules provides graphical packaging for memory modules and other circuit modules. A removable housing is attached to a circuit module containing one or more integrated circuits bonded to a carrier and covered with an encapsulant. Graphics may be printed on the removable housing, or may be printed on an insert that is either inserted into a pocket within the removable housing, or is inserted between a removable housing having a window and the circuit module. Alternatively, the housing itself may be used to personalize the circuit module, by providing a colored or textured removable housing for the circuit module.

Abstract: A circuit module assembly having an edge-attached vented cover and method therefor provides packaging for memory modules and other circuit modules. A vented cover is attached to a circuit carrier having electrical connections on a back side and an encapsulated integrated circuit die on a front side. Adhesive film is placed on a lower edge of the vented cover and the vented cover is attached to the carrier by applying pressure. A vent in the vented cover and a gap in the adhesive film provide an escape path for air that would otherwise be entrapped between the vented cover and the carrier. Multiple vents may be used to provide more airflow and vents may be positioned at the sides of the circuit carrier to minimize the impact of gaps in the adhesive.

Abstract: A method and circuit module package for automated switch actuator insertion provides automated assembly of circuit modules having an integrated switch actuator, such as Secure Digital cards. A switch actuator is inserted automatically into a circuit module package housing by a robotic assembler. The housing and switch actuator have mating surfaces to retain the switch actuator within the housing so that shipping and subsequent assembly do not dislodge the switch actuator. The switch actuator/housing assembly can be contoured such that the switch actuator/housing assemblies may be stacked and then fed to a stack-loading feeder for joining of the actuator/housing assemblies to the remainder of the circuit module package housing. The switch actuator may be made from a material having a higher melting point than the housing so that ultrasonic welding may be performed on the circuit module package without joining the switch actuator permanently to the circuit module package assembly.

Abstract: A method and circuit module package for automated switch actuator insertion provides automated assembly of circuit modules having an integrated switch actuator, such as Secure Digital cards. A switch actuator is inserted automatically into a circuit module package housing by a robotic assembler. The housing and switch actuator have mating surfaces to retain the switch actuator within the housing so that shipping and subsequent assembly do not dislodge the switch actuator. The switch actuator/housing assembly can be contoured such that the switch actuator/housing assemblies may be stacked and then fed to a stack-loading feeder for joining of the actuator/housing assemblies to the remainder of the circuit module package housing. The switch actuator may be made from a material having a higher melting point than the housing so that ultrasonic welding may be performed on the circuit module package without joining the switch actuator permanently to the circuit module package assembly.

Abstract: A personalized circuit module package and method for packaging circuit modules provides graphical packaging for memory modules and other circuit modules. A removable housing is attached to a circuit module containing one or more integrated circuits bonded to a carrier and covered with an encapsulant. Graphics may be printed on the removable housing, or may be printed on an insert that is either inserted into a pocket within the removable housing, or is inserted between a removable housing having a window and the circuit module. Alternatively, the housing itself may be used to personalize the circuit module, by providing a colored or textured removable housing for the circuit module.