Abstract: This disclosure relates generally to directional couplers. In one embodiment, a directional coupler includes a first port, a second port, a third port, a first inductive element, a second inductive element, a first switchable path, and a second switchable path. The first inductive element is coupled between the first port and the second port, while the second inductive element is mutually coupled to the first inductive element. The first switchable path is configured to be opened and closed, wherein the first switchable path is coupled between a first location of the second inductive element and the third port. The second switchable path is configured to be opened and closed, wherein the second switchable path is coupled between a second location of the second inductive element and the third port. In this manner, a directivity of the directional coupler can be switched between a forward direction and a reverse direction.

Abstract: The present disclosure relates to a multi-layer substrate structure with an embedded die to miniaturize designs and improve performance. The multi-layer substrate structure includes a core layer having a cavity and a die mounted within the cavity. The die has a die body, a die conductive element on a top surface of the die body, and a dielectric layer over the die conductive element. The multi-layer substrate structure also includes a substrate conductive element formed over a portion of a top surface of the core layer and extending over at least a portion of the die conductive element. Overlapping portions of the die conductive element and the substrate conductive element are separated by the dielectric layer and form an electronic component.

Abstract: The present disclosure relates to a multi-layer substrate structure with an embedded die to miniaturize designs and improve performance. The multi-layer substrate structure includes a core layer having a cavity and a die mounted within the cavity. The die has a die body, a die conductive element on a top surface of the die body, and a dielectric layer over the die conductive element. The multi-layer substrate structure also includes a substrate conductive element formed over a portion of a top surface of the core layer and extending over at least a portion of the die conductive element. Overlapping portions of the die conductive element and the substrate conductive element are separated by the dielectric layer and form an electronic component.

Abstract: This disclosure relates generally to directional couplers. In one embodiment, a directional coupler includes a first port, a second port, a third port, a first inductive element, a second inductive element, a first switchable path, and a second switchable path. The first inductive element is coupled between the first port and the second port, while the second inductive element is mutually coupled to the first inductive element. The first switchable path is configured to be opened and closed, wherein the first switchable path is coupled between a first location of the second inductive element and the third port. The second switchable path is configured to be opened and closed, wherein the second switchable path is coupled between a second location of the second inductive element and the third port. In this manner, a directivity of the directional coupler can be switched between a forward direction and a reverse direction.