Patents by Inventor John B. Blum

John B. Blum has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lid stock using oriented fluoropolymers
    Patent number: 7939150
    Abstract: Fluoropolymer-containing lidding films for food, non-food and medical packages, including a two-piece sealed package having container and lid portions that are readily separable from each other. Thin, transparent films may be formed having excellent barrier properties suitable for packaging applications, particularly blister packaging.
    Type: Grant
    Filed: August 16, 2005
    Date of Patent: May 10, 2011
    Assignee: Honeywell International Inc.
    Inventors: Carl E. Altman, John B. Blum
  • Method of forming a blister package including a fluoropolymer layer
    Patent number: 7337593
    Abstract: Blister packages are provided which are formed from multilayered films having a lid-stock film which is heat sealed directly to a fluoropolymer film. A polymeric base layer is adhered to a fluoropolymer layer via a first intermediate adhesive tie layer; a support layer is adhered to the fluoropolymer layer via a second intermediate adhesive tie layer; and a metallic foil layer is adhered to the support layer via a third intermediate adhesive tie layer. The blister has a greatly improved moisture barrier over blister packages of the prior art.
    Type: Grant
    Filed: October 5, 2004
    Date of Patent: March 4, 2008
    Assignee: Honeywell International Inc.
    Inventors: John B. Blum, Sandra E. Luciano
  • Method of Bonding Metals to Ceramics
    Publication number: 20070231590
    Abstract: A metal layer is bonded to a ceramic substrate in a method, wherein a first metal layer (e.g., a copper film) is first applied to a surface of the ceramic substrate. The ceramic substrate, with the first metal layer applied thereto, is then heated in an atmosphere including oxygen (e.g., to a temperature below the eutectic temperature of the metal oxide) to form an adhesion-promotion layer. A second metal layer (e.g., a copper foil) is then bonded to the adhesion-promotion layer. Where the metal is copper, the adhesion promotion layer can include copper oxide and copper aluminum oxide.
    Type: Application
    Filed: November 30, 2006
    Publication date: October 4, 2007
    Applicant: STELLAR INDUSTRIES CORP.
    Inventor: John B. Blum
  • Blister package
    Publication number: 20030203141
    Abstract: Blister packages are provided which are formed from multilayered films having a lid-stock film which is heat sealed directly to a fluoropolymer film. A polymeric base layer is adhered to a fluoropolymer layer via a first intermediate adhesive tie layer; a support layer is adhered to the fluoropolymer layer via a second intermediate adhesive tie layer; and a metallic foil layer is adhered to the support layer via a third intermediate adhesive tie layer. The blister has a greatly improved moisture barrier over blister packages of the prior art.
    Type: Application
    Filed: September 11, 2002
    Publication date: October 30, 2003
    Inventors: John B. Blum, Sandra E. Luciano